轧制与退火处理对粉末冶金Cu/Invar电子封装复合材料结构和性能的影响
알제여퇴화처리대분말야금Cu/Invar전자봉장복합재료결구화성능적영향
Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy
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