CAJ | 학술논문

基于半导体制冷器的结构和热电耦合特性，通过分离帕尔帖效应和焦耳效应的响应区域简化了内热源表达式，并利用椭圆偏微分方程建立了热电制冷器的新型热传导模型。该模型仅需制造商提供的标准参数，不依赖于热电偶的物理和几何参数，因而在输入电流和边界条件确定后可实现半导体制冷器在非均匀热流下温度场的数值分析。文中通过拟合制造商提供的产品测试数据验证了模型的通用性，利用该模型得到了含热电制冷器的小尺寸半导体功率器件散热系统的三维和切面温度场分布图，并对该散热系统进行了共性分析。
기우반도체제랭기적결구화열전우합특성，통과분리파이첩효응화초이효응적향응구역간화료내열원표체식，병이용타원편미분방정건립료열전제랭기적신형열전도모형。해모형부수제조상제공적표준삼수，불의뢰우열전우적물리화궤하삼수，인이재수입전류화변계조건학정후가실현반도체제랭기재비균균열류하온도장적수치분석。문중통과의합제조상제공적산품측시수거험증료모형적통용성，이용해모형득도료함열전제랭기적소척촌반도체공솔기건산열계통적삼유화절면온도장분포도，병대해산열계통진행료공성분석。
Based on the structure and coupling characteristics of semiconductor thermoelectric cooler, the expression of inner heat source is simplified through separating the responding area of Peltier effect and Joule effect, and a new heat conduction model of thermoelectric cooler is established with the help of elliptic partial differential equation. This model is independent of the physical and geometrical parameters of the thermoelectric couple, and it only needs the standard parameters provided by the producer, so that the numerical analysis of temperature field of nonuniform heat flow can be realized at given current and boundary conditions.Then, the universality of the proposed model is verified by fitting manufacturer’ s data.Moreover, with the help of this model, the three-dimension and sectional temperature field distributions in the heat dissipation system of small-size semiconductor power devices with thermoe-lectric cooler are obtained, and the common characteristics of such heat dissipation system is revealed.