CAJ | 학술논문

针对陶瓷基微热板MEMS器件难以微加工，器件表面加热Pt膜使用普通正性光刻胶难以实现光刻剥离的工艺难点问题，提出了激光微加工和柔性机械剥离相结合的微加工方法。以AlN陶瓷为衬底基片，采用激光微加工技术实现热隔离刻蚀体加工，刻蚀梁宽可达0.2 mm。采用柔性机械剥离工艺制备方法解决普通正性光刻胶形成倒梯形凹槽Pt膜难实现图形化问题，可在复杂表面特性的陶瓷基衬底上实现Pt膜剥离线宽10μm。同时利用有限元法进行传感器阵列设计和热结构仿真，验证设计工艺的可行性。
침대도자기미열판MEMS기건난이미가공，기건표면가열Pt막사용보통정성광각효난이실현광각박리적공예난점문제，제출료격광미가공화유성궤계박리상결합적미가공방법。이AlN도자위츤저기편，채용격광미가공기술실현열격리각식체가공，각식량관가체0.2 mm。채용유성궤계박리공예제비방법해결보통정성광각효형성도제형요조Pt막난실현도형화문제，가재복잡표면특성적도자기츤저상실현Pt막박리선관10μm。동시이용유한원법진행전감기진렬설계화열결구방진，험증설계공예적가행성。
In order to solve the problems of difficult machining of ceramic-based micro-hotplate MEMS devices and failure lithography stripping of Pt film using conventional positive photoresist,AlN ceramic is as a substrate for the micro-hotplate sensor array and the laser micromachining technology is employed to realize the thermal isolation etching,the etched beam width in the thermal isolation structure is about 0. 2 mm. In addition,a flexible mechanical lift-off method is also proposed to solve the difficult lithography stripping of Pt film with an inverse-echelon indentation using conventional positive photoresist. This method can realize a 10 μm line width of lithography stripping of Pt film on ceramic-based substrate. Moreover,ANSYS software is explored to design the senor array and simulate its thermal structure.