CAJ | 학술논문

采用直流等离子体增强化学气相沉积技术（DC‐PECVD），通过控制基体负偏压的变化在YG8硬质合金基体上制备一系列类金刚石涂层。选用扫描电子显微镜、原子力显微镜、拉曼光谱、X射线光电子能谱、粗糙度仪对涂层形貌和结构进行表征测试。同时，利用显微硬度计、划痕测试仪系统地分析涂层的显微硬度和界面结合性能。结果表明：随着负偏压增大，涂层表面形貌逐渐平整光滑、致密，颗粒尺寸减小及数量降低。拉曼光谱表明，涂层具有典型的类金刚石结构，涂层中sp3键含量呈先增大后减小趋势，最大值约67．9％出现在负偏压为1000V左右，负偏压过大导致sp3键含量降低。显微硬度随负偏压变化规律与s p3键基本相符，s p3键含量决定显微硬度值大小。负偏压过大对吸附离子产生反溅射作用导致涂层厚度减小。当负偏压为1100V时，涂层与基体间的界面结合性能最优。
채용직류등리자체증강화학기상침적기술（DC‐PECVD），통과공제기체부편압적변화재YG8경질합금기체상제비일계렬류금강석도층。선용소묘전자현미경、원자력현미경、랍만광보、X사선광전자능보、조조도의대도층형모화결구진행표정측시。동시，이용현미경도계、화흔측시의계통지분석도층적현미경도화계면결합성능。결과표명：수착부편압증대，도층표면형모축점평정광활、치밀，과립척촌감소급수량강저。랍만광보표명，도층구유전형적류금강석결구，도층중sp3건함량정선증대후감소추세，최대치약67．9％출현재부편압위1000V좌우，부편압과대도치sp3건함량강저。현미경도수부편압변화규률여s p3건기본상부，s p3건함량결정현미경도치대소。부편압과대대흡부리자산생반천사작용도치도층후도감소。당부편압위1100V시，도층여기체간적계면결합성능최우。
A series of diamond‐like‐carbon coatings (DLC) were deposited on top of YG8 cemented carbides by direct current plasma enhanced chemical vapor deposition (DC‐PECVD) in different sub‐strate negative bias voltage .Scanning electron microscopy ,atomic force microscopy ,roughness test‐er ,micro‐hardness tester , scratch tester , Raman spectroscopy , X‐ray photoelectron spectroscopy w ere used to study the composition ,surface morphology ,micro‐hardness and interfacial adhesion per‐formance of the DLC coatings .The results show that the coatings’ surface morphology gradually be‐comes smooth and dense with the increasing of the substrate negative bias voltage .Meanwhile ,the number and size of particles decrease .The DLC coatings exhibit typical diamond‐like characteristics from Raman spectroscopy .The fraction belonging to sp3 valence bond is approach to a maximum value at 1000V and then decreases with the increase of the substrate negative bias voltage .The maximum value of the sp3 valence bond is determined to be about 67.9% .Micro‐hardness varying pattern is con‐sistent with sp3 content change low ,sp3 content determines the micro‐hardness of the DLC coatings . Ions sputtering could lead to the decrease of the thickness w hen the substrate negative bias voltage in‐creases excessively .The best adhesive strength is gained among the coatings when the substrate nega‐tive bias voltage is near to 1100V .