红外与激光工程
紅外與激光工程
홍외여격광공정
INFRARED AND LASER ENGINEERING
2015年
7期
1996-2001
,共6页
胡晓冬%徐元飞%姚建华%于成松
鬍曉鼕%徐元飛%姚建華%于成鬆
호효동%서원비%요건화%우성송
半导体激光器%加工系统%温度控制%激光相变硬化
半導體激光器%加工繫統%溫度控製%激光相變硬化
반도체격광기%가공계통%온도공제%격광상변경화
semiconductor laser%processing system%temperature control%laser transformation hardening
半导体激光器及其工业应用是激光领域研究与发展的热点,国内大功率半导体激光器的发展已经取得了较大进展,但基于国产大功率半导体直接输出激光器的自动化加工装备研究较少。研制了国产大功率半导体直接输出激光加工系统,开发了基于DSP的嵌入式激光加工过程检测与控制系统,设计了用于该系统闭环温度控制的模糊控制算法,并取得了良好的温度控制效果。基于该平台开展了激光宽带相变硬化实验,实验表明:在温度控制模式下,相变硬化层深度和硬度的一致性要优于恒定功率模式。
半導體激光器及其工業應用是激光領域研究與髮展的熱點,國內大功率半導體激光器的髮展已經取得瞭較大進展,但基于國產大功率半導體直接輸齣激光器的自動化加工裝備研究較少。研製瞭國產大功率半導體直接輸齣激光加工繫統,開髮瞭基于DSP的嵌入式激光加工過程檢測與控製繫統,設計瞭用于該繫統閉環溫度控製的模糊控製算法,併取得瞭良好的溫度控製效果。基于該平檯開展瞭激光寬帶相變硬化實驗,實驗錶明:在溫度控製模式下,相變硬化層深度和硬度的一緻性要優于恆定功率模式。
반도체격광기급기공업응용시격광영역연구여발전적열점,국내대공솔반도체격광기적발전이경취득료교대진전,단기우국산대공솔반도체직접수출격광기적자동화가공장비연구교소。연제료국산대공솔반도체직접수출격광가공계통,개발료기우DSP적감입식격광가공과정검측여공제계통,설계료용우해계통폐배온도공제적모호공제산법,병취득료량호적온도공제효과。기우해평태개전료격광관대상변경화실험,실험표명:재온도공제모식하,상변경화층심도화경도적일치성요우우항정공솔모식。
Semiconductor lasers and their industrial applications are research focus in laser field, the development of domestic high power semiconductor lasers has made great progress, but the research on automated processing equipment based on domestic high power semiconductor direct output lasers is few. A laser processing equipment was developed which was based on domestic high power direct output semiconductor lasers. DSP-based embedded control system was also developed for laser processing measurement and control, and fuzzy control algorithm was designed for closed-loop temperature control, and a desirable temperature control effect was acheved. Wideband laser transformation hardening experiments on this platform show that, the consistency of depth and hardness of the transformation hardening layer are better in the temperature control mode contrast to that in the constant power mode.