CAJ | 학술논문

目前工业界对高精度微结构功能表面玻璃元件，比如作为高性能二极管激光器准直透镜关键元件的圆柱槽阵列微结构功能表面玻璃元件的需求日趋增加，而其微结构表面质量的优劣也会直接影响激光器输出功率的大小。该类元件能否很好的实现其特定的光学功能取决于玻璃模压用具有微结构表面的模具(如碳化硅陶瓷等)最终加工质量，但由于碳化硅等陶瓷的超硬材料属性导致其微结构表面在精密磨削后还需要进行后续的抛光加工以达到使用精度要求。因此针对精密磨削后的无压烧结碳化硅(SSiC)微结构表面展开原位化学机械抛光(CMP)试验，试验结果表明，微结构表面粗糙度Ra及面形精度PV由磨削后的71.8 nm和2.14μm降低到了抛光后的7.7 nm和0.46μm；抛光后微结构尖角处形貌完整无破损，但尖角圆弧半径R有所扩大，由磨削后的8.082μm增大到9.294μm；微结构亚表面裂纹深度经抛光后由磨削后的5μm左右降低至1μm左右，从而有效地提高了模具精度。
목전공업계대고정도미결구공능표면파리원건，비여작위고성능이겁관격광기준직투경관건원건적원주조진렬미결구공능표면파리원건적수구일추증가，이기미결구표면질량적우렬야회직접영향격광기수출공솔적대소。해류원건능부흔호적실현기특정적광학공능취결우파리모압용구유미결구표면적모구(여탄화규도자등)최종가공질량，단유우탄화규등도자적초경재료속성도치기미결구표면재정밀마삭후환수요진행후속적포광가공이체도사용정도요구。인차침대정밀마삭후적무압소결탄화규(SSiC)미결구표면전개원위화학궤계포광(CMP)시험，시험결과표명，미결구표면조조도Ra급면형정도PV유마삭후적71.8 nm화2.14μm강저도료포광후적7.7 nm화0.46μm；포광후미결구첨각처형모완정무파손，단첨각원호반경R유소확대，유마삭후적8.082μm증대도9.294μm；미결구아표면렬문심도경포광후유마삭후적5μm좌우강저지1μm좌우，종이유효지제고료모구정도。
At present, the application of the micro-structured optical elements is continuously expanding, while the micro-structured surfaces should meet the required final quality to ensure the specific optical function. For example, collimation lenses for high performance diode lasers show an increasing industrial application with the requirement for micro-structured glass optical elements with cylindrical lens arrays, and the worse quality of cylindrical lens arrays may decrease the power output of the lasers. In essence, the optical properties of optical elements depend on the machined quality of the micro-structured mold used for the replication of the optical elements. However in consideration of the excellent property of pressureless sinter silicon carbide (SiC), the ground micro-structured surface quality is hard to meet the requirement, therefore the in-situ abrasive polishing of micro-structures of molds is proposed. The experimental results show that the surface roughnessRa and profile accuracy PV of the micro-structured surface decrease from 71.8 nm and 2.14 μm through grinding to 7.7 nm and 0.46 μm through abrasive polishing. In addition, the morphology of the polished groove tip is more integrated, while the tip radiusR is expanded from 6.882 μm to 9.2936 μm after polishing. Moreover, although the sub-surface crack is not yet completely removed after polishing, the deepness of the crack is obviously shallow which effectively improve the service life of molds.