表面技术
錶麵技術
표면기술
SURFACE TECHNOLOGY
2015年
8期
115-119
,共5页
涂层导体%Ni-5％W基带%脉冲电流%电化学抛光%磷酸%平均粗糙度
塗層導體%Ni-5％W基帶%脈遲電流%電化學拋光%燐痠%平均粗糙度
도층도체%Ni-5％W기대%맥충전류%전화학포광%린산%평균조조도
coated conductor%Ni-5％W alloy substrate%pulse current%electrochemical polishing%phosphoric acid%average surface roughness
目的：研究提高NiW合金基带表面质量的脉冲电化学最佳抛光工艺。方法以磷酸为主要抛光酸剂,以甘油为缓冲剂配置抛光液,采用脉冲电化学抛光技术,研究电流密度、脉冲频率、脉冲占空比对NiW基带的表面抛光效果的影响。通过扫描电镜和原子力显微镜对抛光后的基带表面微观形貌进行表征,获得最佳脉冲电化学抛光工艺。结果最佳工艺为：平均电流密度25 A/dm2,脉冲频率毫秒级(1000 Hz以上),脉冲占空比1：4,抛光时间10 min。扫描电镜结果表明,抛光后的基带表面平整致密,轧制和热处理产生的条纹、晶界等缺陷都被消除,在此抛光工艺下,可以有效降低NiW基带表面粗糙度,提高基带表面质量。原子力显微镜测试4μm×4μm范围内的表面平均粗糙度为几个纳米,表明抛光基带表面非常平滑,达到镜面效果。结论最佳抛光工艺下,可以显著改善NiW基带的表面质量,获得好的基带表面状态,满足涂层导体对金属基带材料表面质量的要求。
目的：研究提高NiW閤金基帶錶麵質量的脈遲電化學最佳拋光工藝。方法以燐痠為主要拋光痠劑,以甘油為緩遲劑配置拋光液,採用脈遲電化學拋光技術,研究電流密度、脈遲頻率、脈遲佔空比對NiW基帶的錶麵拋光效果的影響。通過掃描電鏡和原子力顯微鏡對拋光後的基帶錶麵微觀形貌進行錶徵,穫得最佳脈遲電化學拋光工藝。結果最佳工藝為：平均電流密度25 A/dm2,脈遲頻率毫秒級(1000 Hz以上),脈遲佔空比1：4,拋光時間10 min。掃描電鏡結果錶明,拋光後的基帶錶麵平整緻密,軋製和熱處理產生的條紋、晶界等缺陷都被消除,在此拋光工藝下,可以有效降低NiW基帶錶麵粗糙度,提高基帶錶麵質量。原子力顯微鏡測試4μm×4μm範圍內的錶麵平均粗糙度為幾箇納米,錶明拋光基帶錶麵非常平滑,達到鏡麵效果。結論最佳拋光工藝下,可以顯著改善NiW基帶的錶麵質量,穫得好的基帶錶麵狀態,滿足塗層導體對金屬基帶材料錶麵質量的要求。
목적：연구제고NiW합금기대표면질량적맥충전화학최가포광공예。방법이린산위주요포광산제,이감유위완충제배치포광액,채용맥충전화학포광기술,연구전류밀도、맥충빈솔、맥충점공비대NiW기대적표면포광효과적영향。통과소묘전경화원자력현미경대포광후적기대표면미관형모진행표정,획득최가맥충전화학포광공예。결과최가공예위：평균전류밀도25 A/dm2,맥충빈솔호초급(1000 Hz이상),맥충점공비1：4,포광시간10 min。소묘전경결과표명,포광후적기대표면평정치밀,알제화열처리산생적조문、정계등결함도피소제,재차포광공예하,가이유효강저NiW기대표면조조도,제고기대표면질량。원자력현미경측시4μm×4μm범위내적표면평균조조도위궤개납미,표명포광기대표면비상평활,체도경면효과。결론최가포광공예하,가이현저개선NiW기대적표면질량,획득호적기대표면상태,만족도층도체대금속기대재료표면질량적요구。
ABSTRACT:Objective To develop an optimal pulse electrochemical polishing technology to improve the surface quality of Ni5%W alloy substrate. Methods Using environment friendly phosphoric acid and glycerol buffer additives as the polishing system. Pulse electrochemical polishing technique was used to study the influences of pulse parameters, namely current density, pulse fre-quency and pulse duty cycle on the surface polishing effects of NiW substrate. The microstructure of the polished substrate surface was characterized by scanning electron microscope and atomic force microscope. The best pulse electrochemical polishing process was obtained according to the test results. Results The best pulse electrochemical polishing process conditions were as following:Jm=25 A/dm2 , f =1000 Hz, duty cycle 1:4, t=10 min. The SEM test results showed that the baseband surface was smooth and compact after polishing. Rolling and heat treatment defects such as streaks and grain boundary were eliminated. The surface rough-ness of NiW substrate was effectively reduced and the surface quality was improved by the optimized polishing process. The AFM tests results showed that the average surface roughness was a few nanometers within the 4 μm×4 μm range, showing that the pol-ished substrate surface was very smooth, reaching mirror state. Conclusion The optimal polishing process could significantly im-prove the surface quality of the substrate and achieve good substrate surface state. It could meet the requirements of coated conduc-tor on the surface quality of metal substrate materials.
