CAJ | 학술논문

喷雾冷却由于在较小的工质流量下可以实现很高的散热能力，在高热流密度散热、电子元器件热控等领域具有广阔的应用前景。针对较大面积的发热表面的温度控制和热量散出，本文建立闭式喷雾冷却循环系统，并选取板式多喷嘴阵列，对其在单相阶段瞬态和稳态时的换热特性进行研究。系统选取水为工质，冷却30mm ×30mm 的发热表面。试验中测试了板式多喷嘴阵列的雾化性能，并得出了在单相阶段时瞬态的温度变化曲线和不同体积流量下的喷雾冷却曲线。试验结果表明，板式多喷嘴阵列的雾化特性较为均匀，且喷雾冷却在单相阶段能达到较高换热性能，而流量对换热影响明显，在更大的流量下换热性能更显著。
분무냉각유우재교소적공질류량하가이실현흔고적산열능력，재고열류밀도산열、전자원기건열공등영역구유엄활적응용전경。침대교대면적적발열표면적온도공제화열량산출，본문건립폐식분무냉각순배계통，병선취판식다분취진렬，대기재단상계단순태화은태시적환열특성진행연구。계통선취수위공질，냉각30mm ×30mm 적발열표면。시험중측시료판식다분취진렬적무화성능，병득출료재단상계단시순태적온도변화곡선화불동체적류량하적분무냉각곡선。시험결과표명，판식다분취진렬적무화특성교위균균，차분무냉각재단상계단능체도교고환열성능，이류량대환열영향명현，재경대적류량하환열성능경현저。
The spray cooling can reach high cooling capacity with small flow rate,so it has broad application prospect in the field of high heat flux removal and thermal control of electronic chips.The closed loop spray cooling system was set up,the plate multi-nozzle array and big heating surface were used .Water was used as working fluid and the heating surface was 30mm × 30mm.The atomization characteristics of plate multi-nozzle array were tested in the experiment.Transient temperature curves and spray cooling curves under different flow rate in the non-boiling regime were also obtained.The results indicated that the atomiza-tion characteristics were uniform,and plate multi-nozzle array could achieve a high heat transfer performance in the non-boiling re-gime.In addition,the flow rate affected heat transfer significantly,and the heat transfer was increased with the increasing of flow rate.