CAJ | 학술논문

利用超音速气雾化装置制备了Sn0.3Ag0.7Cu无铅焊锡粉末，用扫描电子显微镜和激光粒度分析仪对粉末的微观形貌和粒度分布进行表征，并提出一种反应质量差法计算粉末的氧含量，分析了雾化气体压力对粉末有效雾化率、微观形貌、粒度分布以及氧化程度的影响。结果表明：雾化气体压力对粉末的有效雾化率、微观形貌、粒度分布影响较大。粉末的有效雾化率随雾化气体压力的增加而不断提高；相对高的气压下粉末球形度好，0.6 MPa压力下雾化粉末的球形度好且无团聚；随着雾化气体压力的增大，粉末不断细化，且随着雾化压力的提高，粉末粒度减小幅度逐渐变缓；粉末中的氧含量随雾化气体压力的增大略有增加，高的氧含量使粉末表面粗糙度增大。
이용초음속기무화장치제비료Sn0.3Ag0.7Cu무연한석분말，용소묘전자현미경화격광립도분석의대분말적미관형모화립도분포진행표정，병제출일충반응질량차법계산분말적양함량，분석료무화기체압력대분말유효무화솔、미관형모、립도분포이급양화정도적영향。결과표명：무화기체압력대분말적유효무화솔、미관형모、립도분포영향교대。분말적유효무화솔수무화기체압력적증가이불단제고；상대고적기압하분말구형도호，0.6 MPa압력하무화분말적구형도호차무단취；수착무화기체압력적증대，분말불단세화，차수착무화압력적제고，분말립도감소폭도축점변완；분말중적양함량수무화기체압력적증대략유증가，고적양함량사분말표면조조도증대。
Sn0.3Ag0.7Cu lead-free solder powders were prepared by supersonic gas atomization equipment. The scan-ning electron microscope and laser particle size analyzer were used to characterize the microstructure and size dis-tribution of the powder, respectively. The method of mass difference after reaction between solder powders was used to calculate the oxygen content of powders. The effects of gas pressure on the effective atomization rate, pow-der microstructure, size distribution and oxygen content were investigated. The results indicate that the gas pres-sure has great influence on the effective atomization rate, powder microstructure and size distribution of the pow-ders. The effective atomization rate increases with the gas pressure increasing. The sphericity of the powders is bet-ter under higher gas pressure, while it is best when the gas pressure is 0.6 MPa. The powder size becomes smaller as the gas pressure increasing, which decreases slowly under higher pressure. The oxygen content of the powders increases slightly with the gas pressure increasing, causing bad powder surface.