军用倒装焊集成电路的发展和评价标准综述
군용도장한집성전로적발전화평개표준종술
Development and Evaluation Criteria of the Integrated Circuits for the Military Flip Chip
  • 万方数据
    无线互联科技 무선호련과기
    WUXIAN HULIAN KEJI
    2015年 11期 87-89 ,共3页

    王一刚%李锟

    왕일강%리곤

    倒装焊%集成电路%标准 倒裝銲%集成電路%標準
    도장한%집성전로%표준
    Flip chip%Integrated circuit%Standard
    文章论述了倒装焊集成电路的技术特点,详述了NASA、美军对倒装焊集成电路开展的相关研究工作以及美军标的最新发展情况;针对倒装焊集成电路的失效模式,提出军用倒装焊集成电路相关评价试验方法标准.
    문장논술료도장한집성전로적기술특점,상술료NASA、미군대도장한집성전로개전적상관연구공작이급미군표적최신발전정황;침대도장한집성전로적실효모식,제출군용도장한집성전로상관평개시험방법표준.
    Is discussed in this paper. The technical characteristics of lfip chip integrated circuit, NASA, the U.S. to lfip chip integrated circuit to carry out the related research work and the military standard of the latest development is discussed in detail; for flip chip integrated circuit failure mode, puts forward protection lfip chip integrated circuit related evaluation price standard test method.
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