电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2015年
8期
9-12
,共4页
赵博%郭怀新%程凯%王子良
趙博%郭懷新%程凱%王子良
조박%곽부신%정개%왕자량
封装%应力%有限元%可靠性
封裝%應力%有限元%可靠性
봉장%응력%유한원%가고성
package%stress concentration%finite element method%reliability
针对器件在密封检测过程中的失效现象,采用ABAQUS有限元模拟软件,建立失效器件外壳的密封试验三维仿真模型,分别对失效结构封装件和改进结构封装件进行密封测试环境下的应力计算分析。计算结果从理论上解释了失效结构在密封试验时易出现严重的因瓷件微裂纹或开裂引起的失效现象。盖板的结构直接影响外壳整体应力的形式,通过结构调整,封装件薄弱区(外壳瓷件区域)的拉应力仅为原结构的63.3%,表明通过盖板结构的改进可有效避免该类失效现象,对封装可靠性的设计有一定的指导意义。
針對器件在密封檢測過程中的失效現象,採用ABAQUS有限元模擬軟件,建立失效器件外殼的密封試驗三維倣真模型,分彆對失效結構封裝件和改進結構封裝件進行密封測試環境下的應力計算分析。計算結果從理論上解釋瞭失效結構在密封試驗時易齣現嚴重的因瓷件微裂紋或開裂引起的失效現象。蓋闆的結構直接影響外殼整體應力的形式,通過結構調整,封裝件薄弱區(外殼瓷件區域)的拉應力僅為原結構的63.3%,錶明通過蓋闆結構的改進可有效避免該類失效現象,對封裝可靠性的設計有一定的指導意義。
침대기건재밀봉검측과정중적실효현상,채용ABAQUS유한원모의연건,건립실효기건외각적밀봉시험삼유방진모형,분별대실효결구봉장건화개진결구봉장건진행밀봉측시배경하적응력계산분석。계산결과종이론상해석료실효결구재밀봉시험시역출현엄중적인자건미렬문혹개렬인기적실효현상。개판적결구직접영향외각정체응력적형식,통과결구조정,봉장건박약구(외각자건구역)적랍응력부위원결구적63.3%,표명통과개판결구적개진가유효피면해류실효현상,대봉장가고성적설계유일정적지도의의。
For failure situations of devices in sealing test process, a 3D calculating model of failure situ-ation of devices in sealing test was established using ABAQUS finite element simulation software in the paper, and the stresses of failure structure and improved structure in sealing test were calculated and analyzed, respectively. The calculation results explained failure reason caused by micro cracks or cracking of ceramic in sealing test process, cover plate directly influenced the stress form of whole package.The tensile stress of weakness part (ceramic area) of improved structure was only about 63.3% of the original structure, and show that the failure situation could be effectively avoided through structural optimization of cover plate, while those results would provide more or less guiding for high reliability design of package.