CAJ | 학술논문

以硅通孔（TSV）为核心的三维集成技术是半导体工业界近几年的研发热点，特别是2.5D TSV转接板技术的出现，为实现低成本小尺寸芯片系统封装替代高成本系统芯片（SoC）提供了解决方案。转接板作为中介层，实现芯片和芯片、芯片与基板之间的三维互连，降低了系统芯片制作成本和功耗。在基于TSV转接板的三维封装结构中，新型封装结构及封装材料的引入，大尺寸、高功率芯片和小尺寸、细节距微凸点的应用，都为转接板的微组装工艺及其可靠性带来了巨大挑战。综述了TSV转接板微组装的研究现状，及在转接板翘曲、芯片与转接板的精确对准、微组装相关材料、工艺选择等方面面临的关键问题和研究进展。
이규통공（TSV）위핵심적삼유집성기술시반도체공업계근궤년적연발열점，특별시2.5D TSV전접판기술적출현，위실현저성본소척촌심편계통봉장체대고성본계통심편（SoC）제공료해결방안。전접판작위중개층，실현심편화심편、심편여기판지간적삼유호련，강저료계통심편제작성본화공모。재기우TSV전접판적삼유봉장결구중，신형봉장결구급봉장재료적인입，대척촌、고공솔심편화소척촌、세절거미철점적응용，도위전접판적미조장공예급기가고성대래료거대도전。종술료TSV전접판미조장적연구현상，급재전접판교곡、심편여전접판적정학대준、미조장상관재료、공예선택등방면면림적관건문제화연구진전。
In recent years, 3D integration technology with the key technology of through silicon via (TSV) has been a research and development hotspot of semiconductor industry. Especially, 2.5D TSV interposer technology has been provided a solution for substituting low cost small size die system package for high cost system on chip (SOC). As the medilayer, interposer achieves 3D interconnection between die to die and die to substrate, and has reduced the cost of system on chip and power consumption. In the structure of 3D package based on TSV interposer, there have been very huge challenges for micropackage technology and reliability of interposer, with new type package structures and materials introduced, and with large size high power die and small size fine pitch microbumps applied. In the paper, the currently research of TSV interposer micropackage was summarized, including the key questions and development of warpage of interposer, pinpoint between die and interposer, materials of micropackage, and technics choice, etc.