CAJ | 학술논문

PCB埋铜后能解决一些电子元器件的散热问题，延长电子元器件的寿命。近年来，用于散热的金属基产品种类越来越多。金属基在电镀后可能会出现铜粒，以此现象为研究对象，模拟金属基加工出现铜粒的条件，从金属基电镀后铜粒着手，简述铜粒产生的影响因素，分析铜粒产生的机理。
PCB매동후능해결일사전자원기건적산열문제，연장전자원기건적수명。근년래，용우산열적금속기산품충류월래월다。금속기재전도후가능회출현동립，이차현상위연구대상，모의금속기가공출현동립적조건，종금속기전도후동립착수，간술동립산생적영향인소，분석동립산생적궤리。
Copper billet embedded in a PCB can solve cooling difficult problem and delay the life of electronic components. This types of PCB which is embedded copper block was designed. The surface of copper billet embedded in a PCB will emerge some copper particle after electroplating. We researched this phenomena and simulated the plant condition of PCB which is embedded copper block. We summarize the main inlfuence of the copper particle and analysis the mechanism of emerging copper particle.