CAJ | 학술논문

镀锡层具有抗腐蚀性、无毒性和可焊性，被广泛应用于印制板领域。文章概述了应用于PCB镀锡过程中的电镀锡工艺种类和添加剂的发展状况。对各种镀锡的工艺和特点进行了归纳、总结，指出未来电镀纯锡仍将占主导地位。介绍了不同添加剂在镀锡中的作用，指出添加剂将由单一型向多样型发展，并对添加剂的应用进行了展望。
도석층구유항부식성、무독성화가한성，피엄범응용우인제판영역。문장개술료응용우PCB도석과정중적전도석공예충류화첨가제적발전상황。대각충도석적공예화특점진행료귀납、총결，지출미래전도순석잉장점주도지위。개소료불동첨가제재도석중적작용，지출첨가제장유단일형향다양형발전，병대첨가제적응용진행료전망。
Tin layer with features of corrosion resistance, non-toxic and weldability, is widely used in the PCB field. This paper outlines the development of tin plating process types and additives used in PCB tinning process. A variety of processes and characteristics of tin are summarized, which shows that pure tin plating indicate future will dominate. It describes the role of different additives in tin, pointes to a variety of additives by a single type of model development, and application of additives prospects.