CAJ | 학술논문

随着PCB产品趋于短小轻薄和组装结构多样化，不少PCB厂商引入了激光制造工艺以应对结构复杂产品的精密加工。二氧化碳激光常用于PCB的微盲孔加工和薄板切割加工，还可用于开发多种材料的精密加工。本课题通过研究激光的线面加工原理及多种板材的激光加工效果，提出了PTFE板料激光切割、激光控深铣槽等新型激光加工技术。
수착PCB산품추우단소경박화조장결구다양화，불소PCB엄상인입료격광제조공예이응대결구복잡산품적정밀가공。이양화탄격광상용우PCB적미맹공가공화박판절할가공，환가용우개발다충재료적정밀가공。본과제통과연구격광적선면가공원리급다충판재적격광가공효과，제출료PTFE판료격광절할、격광공심선조등신형격광가공기술。
As the PCB products tend to be short, thin and diversified assembly structures, many PCB manufacturers introduce laser precision machining to deal with the complex structure product. CO2 laser is used in micro-blind hole machining and sheet cutting. In fact, it can also be used in a variety of materials developing precision machining. By studying the laser line and surface processing principle and the effect of various laser processing, we proposed new laser machining technology such as PTFE material laser cutting, laser depth control milling groove technology and so on.