印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2015年
8期
45-48
,共4页
周久红%温振雄%杨鑫%翟俊威
週久紅%溫振雄%楊鑫%翟俊威
주구홍%온진웅%양흠%적준위
薄芯层压板%增强弹性缓冲材料%热塑性薄膜%纤维增强硅胶
薄芯層壓闆%增彊彈性緩遲材料%熱塑性薄膜%纖維增彊硅膠
박심층압판%증강탄성완충재료%열소성박막%섬유증강규효
Thin Core Laminate%Enhanced-Elastic Buffer Material%Thermoplastic Film%Fiber Reinforced Silica Gel
随着PCB朝薄型化和线路精密化发展，基板要求越来越薄，同时基板可靠性要求越来越高，牛皮纸等传统缓冲材料已经无法完全满足其层压制程中对压力缓冲性的要求，文章主要研究在CCL层压制程中搭配使用增强弹性缓冲材料，以降低薄芯层压板缺陷率。
隨著PCB朝薄型化和線路精密化髮展，基闆要求越來越薄，同時基闆可靠性要求越來越高，牛皮紙等傳統緩遲材料已經無法完全滿足其層壓製程中對壓力緩遲性的要求，文章主要研究在CCL層壓製程中搭配使用增彊彈性緩遲材料，以降低薄芯層壓闆缺陷率。
수착PCB조박형화화선로정밀화발전，기판요구월래월박，동시기판가고성요구월래월고，우피지등전통완충재료이경무법완전만족기층압제정중대압력완충성적요구，문장주요연구재CCL층압제정중탑배사용증강탄성완충재료，이강저박심층압판결함솔。
With the development of PCB towards thinning and line-precision, substrate is required thinner and thinner, the reliability of substrate is requested higher, craft paper and other traditional buffer materials have been unable to meet the requirement for pressure buffer in the process of lamination, this paper mainly studies collocation in using enhanced-elastic buffer material in the process of CCL lamination, in order to reduce the defect rate of thin core laminate.
