印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2015年
8期
29-34
,共6页
范红%王红飞%赵亮兵%陈蓓
範紅%王紅飛%趙亮兵%陳蓓
범홍%왕홍비%조량병%진배
低轮廓铜箔%粗糙度%电阻%介电常数%损耗
低輪廓銅箔%粗糙度%電阻%介電常數%損耗
저륜곽동박%조조도%전조%개전상수%손모
Low Proifle Copper Foil%Roughness%Resistance%The Dielectric Constant%Insertion Loss
铜箔作为线路板中电子与信号传导通道的载体,是PCB制造中重要原料。随高频、高速PCB发展,低粗糙度铜箔应用越发广泛。本文主要研究三种不同粗糙度铜箔对PCB传输线直流电阻和高频材料的介电参数的影响,以及研究低轮廓铜箔与高频树脂体系材料结合的抗剥离强度。具体比较聚苯醛复合树脂、改性环氧树脂板材与STD、RTF、VLP铜箔的剥离强度,以及铜箔类型对线路的直流电阻以及材料介电常数、损耗的影响。
銅箔作為線路闆中電子與信號傳導通道的載體,是PCB製造中重要原料。隨高頻、高速PCB髮展,低粗糙度銅箔應用越髮廣汎。本文主要研究三種不同粗糙度銅箔對PCB傳輸線直流電阻和高頻材料的介電參數的影響,以及研究低輪廓銅箔與高頻樹脂體繫材料結閤的抗剝離彊度。具體比較聚苯醛複閤樹脂、改性環氧樹脂闆材與STD、RTF、VLP銅箔的剝離彊度,以及銅箔類型對線路的直流電阻以及材料介電常數、損耗的影響。
동박작위선로판중전자여신호전도통도적재체,시PCB제조중중요원료。수고빈、고속PCB발전,저조조도동박응용월발엄범。본문주요연구삼충불동조조도동박대PCB전수선직류전조화고빈재료적개전삼수적영향,이급연구저륜곽동박여고빈수지체계재료결합적항박리강도。구체비교취분철복합수지、개성배양수지판재여STD、RTF、VLP동박적박리강도,이급동박류형대선로적직류전조이급재료개전상수、손모적영향。
The copper foil as the carrier of electronics and signal transduction channel in printed circuit board, is one of the most important raw material for PCB manufacturing. With the development of high-frequency and high-speed PCB, low proifle copper foil is widely used in speciifc ifelds. This paper mainly studies the impact of copper roughness on DC resistance and dielectric properties of PCB materials. Peel strength and insertion loss of STD, RTF and VLP laminated with different high-frequency laminates were studied.