日用电器
日用電器
일용전기
ELECTRICAL APPLIANCES
2015年
8期
131-132,138
,共3页
BGA%底部填充胶%评估
BGA%底部填充膠%評估
BGA%저부전충효%평고
BGA%underfill%evaluation
由于BGA芯片存在因应力集中而出现的可靠性质量隐患问题,为了使BGA封装具备更高的机械可靠性,需对BGA进行底部填充,而正确选择底部填充胶对产品可靠性有很大影响。本文通过介绍底部填充胶在实际应用中需重点关注的关键参数、工艺特性及可靠性试验项目的评估方法,并结合实际工艺制程,考虑底部填充胶返修性能、固化温度、固化时间等因素,探讨在实际应用中如何选择和评估底部填充胶。
由于BGA芯片存在因應力集中而齣現的可靠性質量隱患問題,為瞭使BGA封裝具備更高的機械可靠性,需對BGA進行底部填充,而正確選擇底部填充膠對產品可靠性有很大影響。本文通過介紹底部填充膠在實際應用中需重點關註的關鍵參數、工藝特性及可靠性試驗項目的評估方法,併結閤實際工藝製程,攷慮底部填充膠返脩性能、固化溫度、固化時間等因素,探討在實際應用中如何選擇和評估底部填充膠。
유우BGA심편존재인응력집중이출현적가고성질량은환문제,위료사BGA봉장구비경고적궤계가고성,수대BGA진행저부전충,이정학선택저부전충효대산품가고성유흔대영향。본문통과개소저부전충효재실제응용중수중점관주적관건삼수、공예특성급가고성시험항목적평고방법,병결합실제공예제정,고필저부전충효반수성능、고화온도、고화시간등인소,탐토재실제응용중여하선택화평고저부전충효。
Due to the stress concentration of BGA chip, it results the potential quality problem of reliability. In order to make the BGA encapsulation possess higher mechanical reliability, BGA should be underfilled. Correct selection of underfill has a great influence on product reliability. In this paper, it introduces the evaluation method aiming at key parameters, process characteristics and reliability test items in the application. Combined with the technological pro-cess, and considering the repair performance of underfill, the curing temperature and the curing time, the selection and evaluation of underfill is discussed.