电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
9期
40-42
,共3页
田野%曹全喜%赵方舟
田野%曹全喜%趙方舟
전야%조전희%조방주
KBT%PTC%晶界应力%居里温度%钙钛矿结构%无铅化
KBT%PTC%晶界應力%居裏溫度%鈣鈦礦結構%無鉛化
KBT%PTC%정계응력%거리온도%개태광결구%무연화
KBT%PTC%boundary stress%Curie temperature%perovskite structure%lead-free
采用固相法制备了掺杂(K0.5Bi0.5)TiO3(KBT)的钛酸钡基无铅PTC陶瓷材料(K0.5Bi0.5)xBa(1–x)TiO3。利用X射线衍射、扫描电子显微镜、电阻-温度测试对材料的微观组织和热敏特性进行了表征,研究了晶界处应力对所制陶瓷材料居里温度(t C )的影响,发现通过构建更多的氧八面体结构来减小晶界应力有助于提高居里温度,并制出了居里温度为137℃的无铅PTC元件。
採用固相法製備瞭摻雜(K0.5Bi0.5)TiO3(KBT)的鈦痠鋇基無鉛PTC陶瓷材料(K0.5Bi0.5)xBa(1–x)TiO3。利用X射線衍射、掃描電子顯微鏡、電阻-溫度測試對材料的微觀組織和熱敏特性進行瞭錶徵,研究瞭晶界處應力對所製陶瓷材料居裏溫度(t C )的影響,髮現通過構建更多的氧八麵體結構來減小晶界應力有助于提高居裏溫度,併製齣瞭居裏溫度為137℃的無鉛PTC元件。
채용고상법제비료참잡(K0.5Bi0.5)TiO3(KBT)적태산패기무연PTC도자재료(K0.5Bi0.5)xBa(1–x)TiO3。이용X사선연사、소묘전자현미경、전조-온도측시대재료적미관조직화열민특성진행료표정,연구료정계처응력대소제도자재료거리온도(t C )적영향,발현통과구건경다적양팔면체결구래감소정계응력유조우제고거리온도,병제출료거리온도위137℃적무연PTC원건。
The (K0.5Bi0.5)TiO3 (KBT) doped lead-free BaTiO3-based PTC thermistor materials (K0.5Bi0.5)xBa(1–x)TiO3 were prepared by solid state reaction method. Phase component and microstructure of prepared materials were investigated by X-ray diffraction and scanning electron microscope. The electrical properties were studied by resistance-temperature measurement system. The effects of boundary stress on Curie temperature (tC) of the prepared ceramics were discussed. The results show that the decrease of boundary stress by building more oxygen octahedrons is conducive to raise t C and the lead-free PTC components with tC of 137℃ were prepared.