电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
9期
25-30
,共6页
李志刚%张亚玲%曹博%王美茹%邹策策
李誌剛%張亞玲%曹博%王美茹%鄒策策
리지강%장아령%조박%왕미여%추책책
IGBT%热阻%综述%结温%温度测量%对比分析
IGBT%熱阻%綜述%結溫%溫度測量%對比分析
IGBT%열조%종술%결온%온도측량%대비분석
IGBT%thermal resistance%review%junction temperature%temperature measurement%comparative analysis
通过对近年来国内外 IGBT热阻测量技术进行分析,根据各方法测量原理不同归类为四种方法:热敏参数法、数学物理法、实测结温法、红外扫描法。描述了近年来热阻测量的不断改进之处,并总结了各测量方法的优缺点。最后分析了热阻测量的发展趋势和所需解决的关键问题。
通過對近年來國內外 IGBT熱阻測量技術進行分析,根據各方法測量原理不同歸類為四種方法:熱敏參數法、數學物理法、實測結溫法、紅外掃描法。描述瞭近年來熱阻測量的不斷改進之處,併總結瞭各測量方法的優缺點。最後分析瞭熱阻測量的髮展趨勢和所需解決的關鍵問題。
통과대근년래국내외 IGBT열조측량기술진행분석,근거각방법측량원리불동귀류위사충방법:열민삼수법、수학물리법、실측결온법、홍외소묘법。묘술료근년래열조측량적불단개진지처,병총결료각측량방법적우결점。최후분석료열조측량적발전추세화소수해결적관건문제。
The thermal resistance measuring methods of IGBT are analyzed which published in domestic and abroad in recent years. According to the measuring principle, methods are classified into four:thermal sensitive parameters method, mathematical physics method, the directly measure junction temperature method and the infrared scanning method. The continuous improvements of the thermal resistance measurements in recent years are described, as well as their advantages and disadvantages. At last, the trends of measurement and the key issues which should be solved are pointed out.