绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2015年
8期
33-35,40
,共4页
廖波%张步峰%汤海涛%钱心远%姜其斌
廖波%張步峰%湯海濤%錢心遠%薑其斌
료파%장보봉%탕해도%전심원%강기빈
无规共缩聚%聚酰亚胺薄膜%化学亚胺化
無規共縮聚%聚酰亞胺薄膜%化學亞胺化
무규공축취%취선아알박막%화학아알화
random copolymer%polyimide film%chemical imidization
采用对苯二胺(pPDA)、4,4'-二氨基二苯醚(ODA)、均苯四甲酸二酐(PMDA)制备了pPDA/ODA-PMDA无规共缩聚型聚酰亚胺薄膜,研究了其树脂合成条件、亚胺化方式以及pPDA含量对PI膜性能的影响.结果表明:聚酰胺酸的黏度与反应温度成反比,化学亚胺法可以提高薄膜的热稳定性;随着pPDA含量的增加,PI薄膜的拉伸强度和尺寸稳定性得到明显改善.当pPDA含量为10%~15%时,PI薄膜的综合性能满足设计要求.
採用對苯二胺(pPDA)、4,4'-二氨基二苯醚(ODA)、均苯四甲痠二酐(PMDA)製備瞭pPDA/ODA-PMDA無規共縮聚型聚酰亞胺薄膜,研究瞭其樹脂閤成條件、亞胺化方式以及pPDA含量對PI膜性能的影響.結果錶明:聚酰胺痠的黏度與反應溫度成反比,化學亞胺法可以提高薄膜的熱穩定性;隨著pPDA含量的增加,PI薄膜的拉伸彊度和呎吋穩定性得到明顯改善.噹pPDA含量為10%~15%時,PI薄膜的綜閤性能滿足設計要求.
채용대분이알(pPDA)、4,4'-이안기이분미(ODA)、균분사갑산이항(PMDA)제비료pPDA/ODA-PMDA무규공축취형취선아알박막,연구료기수지합성조건、아알화방식이급pPDA함량대PI막성능적영향.결과표명:취선알산적점도여반응온도성반비,화학아알법가이제고박막적열은정성;수착pPDA함량적증가,PI박막적랍신강도화척촌은정성득도명현개선.당pPDA함량위10%~15%시,PI박막적종합성능만족설계요구.
A series of random copolymer polyimide films were prepared from pyromellitic dianhydride (pPDA), 4,4'-diaminodiphenyl ether(ODA), and p-phenylene diamine (PMDA), and the effects of synthsis condition of resin, imidization methods, and the pPDA content on their properties were studied. The results show that the viscosity was inversely proportional to temperature. The chemical imidization method could improve the thermal stability of PI film. With the increase of pPDA content, the tensile strength and dimensional stability of the PI films are improved obviously. When the pPDA content is 10%~15%, the comprehensive properties of the PI films can satisfy the requirements.