CAJ | 학술논문

电子产品的日益发展要求更高的封装密度、更好的性能和更小的尺寸,使得电子器件所承载的功率密度显著升高,由此产生严重的焦耳热问题,导致作为主要散热通道的微互连焊点内将产生较高的温度梯度,这将诱发金属原子的热迁移,并引起严重的可靠性问题.对近年来有关Sn-Pb、Sn-Ag、Sn-Ag-Cu、Sn-Bi和Sn-Zn等微互连焊点中金属原子的热迁移行为和关键问题进行综合分析,总结热迁移对微互连界面反应的影响,阐述金属原子热迁移的机理和驱动力,并归纳传递热Q*的计算方法及微互连焊点中主要金属元素的Q*值.最后,指出微互连焊点热迁移研究存在的主要问题,并对其未来研究发展趋势进行了展望.
전자산품적일익발전요구경고적봉장밀도、경호적성능화경소적척촌,사득전자기건소승재적공솔밀도현저승고,유차산생엄중적초이열문제,도치작위주요산열통도적미호련한점내장산생교고적온도제도,저장유발금속원자적열천이,병인기엄중적가고성문제.대근년래유관Sn-Pb、Sn-Ag、Sn-Ag-Cu、Sn-Bi화Sn-Zn등미호련한점중금속원자적열천이행위화관건문제진행종합분석,총결열천이대미호련계면반응적영향,천술금속원자열천이적궤리화구동력,병귀납전체열Q*적계산방법급미호련한점중주요금속원소적Q*치.최후,지출미호련한점열천이연구존재적주요문제,병대기미래연구발전추세진행료전망.
The electronic products are increasingly demanding for higher packing density, better performance and smaller size, resulting in significant increase of power density applied on devices. The issue of Joule heating becomes more severe and a temperature gradient will form in the solder joints which act as the main heat dissipation channel. As a result, thermomigration of metal atoms will occur, which causes serious reliability problems of the solder joints. The thermomigration of metal atoms in Sn-Pb, Sn-Ag, Sn-Ag-Cu, Sn-Bi, Sn-Zn micro interconnect solder joints as well as the key issues were analyzed synthetically. The effect of thermomigration on interfacial reaction was included. The mechanism and the driving force of thermomigration of metal atoms were explained. The calculation methods for heat transport (Q*) and the values ofQ* of main metal elements in solder joints were summarized. The main issues and trends of the studies on thermomigration in micro interconnect solder joints were finally proposed.