矿冶工程
礦冶工程
광야공정
Mining and Metallurgical Engineering
2015年
4期
122-125
,共4页
焊接%AZ31B/Cu异种材料%铝中间层%瞬间液相扩散连接%焊接温度%焊接头%显微组织%剪切强度
銲接%AZ31B/Cu異種材料%鋁中間層%瞬間液相擴散連接%銲接溫度%銲接頭%顯微組織%剪切彊度
한접%AZ31B/Cu이충재료%려중간층%순간액상확산련접%한접온도%한접두%현미조직%전절강도
welding%AZ31B/Cu dissimilar material%aluminum interlayer%transient liquid phase diffusion welding%welding temperature%welding joint%microstructure%shear strength
以Al为中间层对AZ31B／Cu异种材料进行瞬间液相扩散连接试验，采用SEM观察接头界面扩散区的组织形貌，结合EDS、XRD分析界面区的物相及成分，采用室温拉伸实验机测试接头剪切强度，研究了焊接温度对AZ31B／Al／Cu界面组织和剪切强度的影响。结果表明，加热温度对Al、Mg、Cu元素扩散影响很大，从而对微观组织和剪切强度产生影响。445℃时，Al、Mg元素扩散不充分，Mg／Al界面无法形成共晶液相，界面结合较弱。450℃时，Al箔完全溶解，界面区宽度显著增加，从Mg侧到Cu侧，扩散区的微观组织依次为α?Mg（Al）固溶体、Mg?Al共晶组织、Cu（Al）固溶体，接头强度最高达到53 MPa，约为母材 AZ31B 剪切强度的33．2％。460℃时，界面扩散区宽度缓慢增大，靠近Cu侧的界面区产生大量脆性Al?Cu化合物，接头强度下降。
以Al為中間層對AZ31B／Cu異種材料進行瞬間液相擴散連接試驗，採用SEM觀察接頭界麵擴散區的組織形貌，結閤EDS、XRD分析界麵區的物相及成分，採用室溫拉伸實驗機測試接頭剪切彊度，研究瞭銲接溫度對AZ31B／Al／Cu界麵組織和剪切彊度的影響。結果錶明，加熱溫度對Al、Mg、Cu元素擴散影響很大，從而對微觀組織和剪切彊度產生影響。445℃時，Al、Mg元素擴散不充分，Mg／Al界麵無法形成共晶液相，界麵結閤較弱。450℃時，Al箔完全溶解，界麵區寬度顯著增加，從Mg側到Cu側，擴散區的微觀組織依次為α?Mg（Al）固溶體、Mg?Al共晶組織、Cu（Al）固溶體，接頭彊度最高達到53 MPa，約為母材 AZ31B 剪切彊度的33．2％。460℃時，界麵擴散區寬度緩慢增大，靠近Cu側的界麵區產生大量脆性Al?Cu化閤物，接頭彊度下降。
이Al위중간층대AZ31B／Cu이충재료진행순간액상확산련접시험，채용SEM관찰접두계면확산구적조직형모，결합EDS、XRD분석계면구적물상급성분，채용실온랍신실험궤측시접두전절강도，연구료한접온도대AZ31B／Al／Cu계면조직화전절강도적영향。결과표명，가열온도대Al、Mg、Cu원소확산영향흔대，종이대미관조직화전절강도산생영향。445℃시，Al、Mg원소확산불충분，Mg／Al계면무법형성공정액상，계면결합교약。450℃시，Al박완전용해，계면구관도현저증가，종Mg측도Cu측，확산구적미관조직의차위α?Mg（Al）고용체、Mg?Al공정조직、Cu（Al）고용체，접두강도최고체도53 MPa，약위모재 AZ31B 전절강도적33．2％。460℃시，계면확산구관도완만증대，고근Cu측적계면구산생대량취성Al?Cu화합물，접두강도하강。
A test of transient liquid phase diffusion welding of AZ31B/Cu was carried out with Al foil as interlayer. The microstructure, morphology, phase and composition of the diffusion interface zone were analyzed by SEM, EDS and XRD, respectively. The shear strength of the joints was tested by tensile testing machine. The effect of welding temperature on the interfacial structures and shear strength of the joints was studied. The results show that the heating temperature has great influence on the diffusion of Al, Mg and Cu elements, which affects the microstructure and shear strength. When the bonding temperature is 445℃, the diffusion of Al and Mg elements is not sufficient, so that eutectic liquid phase cannot form at Mg/Al interface, with an interfacial bond weak. When the temperature is 450℃, Al foil is completely dissolved. The width of the interface zone increases significantly. The microstructure of diffusion zone presents as α?Mg ( Al) solid solution, Mg?Al eutectic structure and Cu ( Al) solid solution in order from Mg side to Cu side. The highest joint strength is up to 53 MPa, about 33. 2% of the shear strength of AZ31B. When the temperature is up to 460 ℃, the width of the interfacial diffusion zone slowly increases. A great amount of Al?Cu fragile compounds generates at the interfacial zone near Cu side with the joint strength decreased.
