航天制造技术
航天製造技術
항천제조기술
Aerospace Manufacturing Technology
2015年
4期
5-9
,共5页
薛青%李扬%刘振波%赵军静%董建涛%张洪旭%王学刚%易帆%李秀春
薛青%李颺%劉振波%趙軍靜%董建濤%張洪旭%王學剛%易帆%李秀春
설청%리양%류진파%조군정%동건도%장홍욱%왕학강%역범%리수춘
IC10%TLP%GH3039%微观组织%力学性能
IC10%TLP%GH3039%微觀組織%力學性能
IC10%TLP%GH3039%미관조직%역학성능
IC10%TLP%GH3039%microstructure%mechanical properties
以BNi2为中间层,在不同的焊接参数下对TLP扩散焊IC10单晶与GH3039高温合金,以及IC10/BNi2/GH3039接头进行了微观组织及力学性能的分析.结果表明:焊接参数对接头界面组织的影响较为复杂,焊接温度的升高并不一定能够促进接头实现完全等温凝固,而保温时间的延长有助于接头实现完全等温凝固;1200℃/2h参数下的的接头常温拉伸强度达到736MPa,900℃高温拉伸强度达到220MPa,综合力学性能最好.
以BNi2為中間層,在不同的銲接參數下對TLP擴散銲IC10單晶與GH3039高溫閤金,以及IC10/BNi2/GH3039接頭進行瞭微觀組織及力學性能的分析.結果錶明:銲接參數對接頭界麵組織的影響較為複雜,銲接溫度的升高併不一定能夠促進接頭實現完全等溫凝固,而保溫時間的延長有助于接頭實現完全等溫凝固;1200℃/2h參數下的的接頭常溫拉伸彊度達到736MPa,900℃高溫拉伸彊度達到220MPa,綜閤力學性能最好.
이BNi2위중간층,재불동적한접삼수하대TLP확산한IC10단정여GH3039고온합금,이급IC10/BNi2/GH3039접두진행료미관조직급역학성능적분석.결과표명:한접삼수대접두계면조직적영향교위복잡,한접온도적승고병불일정능구촉진접두실현완전등온응고,이보온시간적연장유조우접두실현완전등온응고;1200℃/2h삼수하적적접두상온랍신강도체도736MPa,900℃고온랍신강도체도220MPa,종합역학성능최호.
This paper carries out the TLP welding research between crystal alloy IC10 and GH3039 super alloy with BNi2 as interlayer. The microstructure and mechanical properties of IC10/BNi2/GH3039 joints under different welding parameters are analyzed. Results indicate that the effects of welding parameters on the joint microstructure are complex. It is found that improving the welding temperature is not necessarily helpful to achieve isothermal solidification, while improving the holding time is helpful to achieve isothermal solidification. At the parameter of 1200℃/2h, the joint has the best comprehensive performance. The room temperature tensile strength is 736MPa and the 900℃ high-temperature tensile strength is 220MPa.
