CAJ | 학술논문

目的：优化钼表面直流磁控溅射镀镍薄膜的工艺,提出后续热处理方法。方法设计正交实验,探究溅射功率、溅射气压、负偏压和沉积时间对镍薄膜沉积速率和附着力的影响,从而优化工艺参数。利用扫描电镜和平整度仪对最佳工艺参数下制备的薄膜的组织结构进行表征,并研究后续热处理对薄膜附着力的影响。结果工艺参数对镀镍薄膜沉积速率影响的主次顺序为：功率>溅射气压>负偏压；对薄膜附着力的影响主次顺序为：负偏压>沉积时间>功率>溅射气压。随溅射功率增大,沉积速率增大,薄膜附着力先增后减；随溅射气压增大,沉积速率和薄膜附着力均先增后减。负偏压增大对沉积速率影响较小,但有利于提高薄膜附着力。随沉积时间延长,薄膜附着力降低。在氢气气氛下进行850℃×1 h的后续热处理,能够促进扩散层的形成,明显提高镍薄膜的附着力。结论最佳镀镍工艺参数为：溅射功率1.8 kW,溅射气压0.3 Pa,负偏压450 V,沉积时间10 min。在该条件下制备的镍薄膜厚度达到1.15μm左右,与基体结合紧密,表面平整、连续、致密。后续增加热处理工序是提高镍薄膜附着力的有效方法。
목적：우화목표면직류자공천사도얼박막적공예,제출후속열처리방법。방법설계정교실험,탐구천사공솔、천사기압、부편압화침적시간대얼박막침적속솔화부착력적영향,종이우화공예삼수。이용소묘전경화평정도의대최가공예삼수하제비적박막적조직결구진행표정,병연구후속열처리대박막부착력적영향。결과공예삼수대도얼박막침적속솔영향적주차순서위：공솔>천사기압>부편압；대박막부착력적영향주차순서위：부편압>침적시간>공솔>천사기압。수천사공솔증대,침적속솔증대,박막부착력선증후감；수천사기압증대,침적속솔화박막부착력균선증후감。부편압증대대침적속솔영향교소,단유리우제고박막부착력。수침적시간연장,박막부착력강저。재경기기분하진행850℃×1 h적후속열처리,능구촉진확산층적형성,명현제고얼박막적부착력。결론최가도얼공예삼수위：천사공솔1.8 kW,천사기압0.3 Pa,부편압450 V,침적시간10 min。재해조건하제비적얼박막후도체도1.15μm좌우,여기체결합긴밀,표면평정、련속、치밀。후속증가열처리공서시제고얼박막부착력적유효방법。
Objective To optimize the process of plating nickel film on molybdenum disc substrates by direct current magnetron sputtering, and research the follow-up heat treatment. Methods Though designing an orthogonal experiment scheme, the effects of sputtering power, sputtering pressure, bias voltage and deposition time on deposition rate and adhesion of nickel film were re-searched. The organization and structure of nickel film prepared with the optimal parameters were characterized by scanning elec-tron microscope and flatness tester. And the effect of follow-up heat treatment on adhesion of nickel film was also researched. Results The results showed that the primary and secondary order of the effects of the parameters on the deposition rate was:sputte-ring power, sputtering pressure and then bias voltage. The primary and secondary order of the effects of the parameters on the adhe-sion was:bias voltage, deposition rate, sputtering power, and then sputtering pressure. With increasing sputtering power, the dep-osition rate increased and the film adhesion increased at first and then decreased. With increasing deposition time, the deposition rate and film adhesion both increased at first and then decreased. Negative bias had little effect on the deposition rate, but it was beneficial for improving the adhesion of the film. And the film adhesion decreased with the increase of deposition time. The follow-up heat treatment of 1 h incubation at 850 ℃ in hydrogen atmosphere could obviously increase the film adhesion by promoting the formation of the diffusion layer. Conclusion The optimal process parameters of plating nickel film were:sputtering power 1. 8 kW, sputtering pressure 0. 3 Pa, bias voltage 450 V,deposition time 10 min. The thickness of th film was about 1. 15μm. The film and substrate bounded tightly, and the surface of film was smooth, continuous and dense. The follow-up heat treatment was an effective method to improve the adhesion of nickel film.