大连理工大学学报
大連理工大學學報
대련리공대학학보
Journal of Dalian University of Technology
2015年
5期
478-483
,共6页
马雅丽%刘文开%路学成%刘冲
馬雅麗%劉文開%路學成%劉遲
마아려%류문개%로학성%류충
UV-LIGA技术%SU-8胶%微细电铸%微注塑模具型腔
UV-LIGA技術%SU-8膠%微細電鑄%微註塑模具型腔
UV-LIGA기술%SU-8효%미세전주%미주소모구형강
UV-LIGA technology%SU-8 photoresist%micro-electroforming%micro-inj ection mold cavity
设计并制作了微注塑模具型腔.利用无背板生长法,采用 UV-LIGA套刻技术和掩膜腐蚀技术,直接在合金钢基底上制作具有微阵列结构、微注塑浇口、微排气通道、排气孔、聚合物熔体流道等结构的微注塑模具型腔.对 SU-8厚胶的光刻工艺参数进行优化,给出厚度350μm的 SU-8胶的建议工艺条件:固定边框厚度进行刮胶;梯度升温前烘,自65℃至85℃每隔5℃间歇式升温,且85℃的烘焙时间为5.5~6.0 h;紫外光接触式曝光,剂量630 mJ/cm2;85℃中烘15 min,显影20 min.针对 Ni微细电铸过程中产生节瘤现象分析原因并改善工艺参数,将电流密度和 pH 分别控制在3 A/dm2以下和3.8~4.4.最终成功获得高质量的微注塑模具型腔.
設計併製作瞭微註塑模具型腔.利用無揹闆生長法,採用 UV-LIGA套刻技術和掩膜腐蝕技術,直接在閤金鋼基底上製作具有微陣列結構、微註塑澆口、微排氣通道、排氣孔、聚閤物鎔體流道等結構的微註塑模具型腔.對 SU-8厚膠的光刻工藝參數進行優化,給齣厚度350μm的 SU-8膠的建議工藝條件:固定邊框厚度進行颳膠;梯度升溫前烘,自65℃至85℃每隔5℃間歇式升溫,且85℃的烘焙時間為5.5~6.0 h;紫外光接觸式曝光,劑量630 mJ/cm2;85℃中烘15 min,顯影20 min.針對 Ni微細電鑄過程中產生節瘤現象分析原因併改善工藝參數,將電流密度和 pH 分彆控製在3 A/dm2以下和3.8~4.4.最終成功穫得高質量的微註塑模具型腔.
설계병제작료미주소모구형강.이용무배판생장법,채용 UV-LIGA투각기술화엄막부식기술,직접재합금강기저상제작구유미진렬결구、미주소요구、미배기통도、배기공、취합물용체류도등결구적미주소모구형강.대 SU-8후효적광각공예삼수진행우화,급출후도350μm적 SU-8효적건의공예조건:고정변광후도진행괄효;제도승온전홍,자65℃지85℃매격5℃간헐식승온,차85℃적홍배시간위5.5~6.0 h;자외광접촉식폭광,제량630 mJ/cm2;85℃중홍15 min,현영20 min.침대 Ni미세전주과정중산생절류현상분석원인병개선공예삼수,장전류밀도화 pH 분별공제재3 A/dm2이하화3.8~4.4.최종성공획득고질량적미주소모구형강.
A micro-inj ection mold cavity is designed and manufactured.By the method of no back plate growing technology,the micro-inj ection mold cavity with micro-array structure,micro-inj ection gate,micro-exhaust passage,exhaust vent and polymer melt flow channel is directly manufactured on an alloy steel substrate applying overlay UV-LIGA technology and mask etching technology.The optical lithography parameter of SU-8 thick photoresist is optimized and the proposed fabrication process for 350μm SU-8 photoresist is given as follows:scraping photoresist by fixing the thickness of frame,prebaking by gradient heating-up and temperature rising every 5 ℃ from 65 ℃ to 85 ℃,at 85 ℃ for 5.5-6.0 h,UV contacting exposure with dose of 630 mJ/cm2 ,post-baking at 85 ℃ for 15 min and development for 20 min.The causes for generating nodules in the process of Ni micro-electroforming are analyzed,and the process parameter is improved by controlling current density and pH respectively under 3 A/dm2 and 3.8-4.4.As a result,the micro-injection mold cavity of good quality is gained successfully.