郑州大学学报（理学版）
鄭州大學學報（理學版）
정주대학학보（이학판）
Journal of Zhengzhou University (Natural Science Edition)
2015年
3期
73-76
,共4页
分子动力学%相互作用能%高温高湿
分子動力學%相互作用能%高溫高濕
분자동역학%상호작용능%고온고습
molecular dynamics%interaction energy%hot and humid environment
采用分子动力学方法研究了电子封装界面铜/环氧树脂相互作用能，并考虑环氧树脂交联程度、温度和含湿量的影响。研究结果表明，环氧树脂交联程度对铜/环氧树脂界面相互作用能几乎没有影响，而高温和高湿都会使铜/环氧树脂界面黏结性能明显下降。分析表明，湿气含量较高时，湿气穿越环氧树脂层聚集在铜与环氧树脂之间。
採用分子動力學方法研究瞭電子封裝界麵銅/環氧樹脂相互作用能，併攷慮環氧樹脂交聯程度、溫度和含濕量的影響。研究結果錶明，環氧樹脂交聯程度對銅/環氧樹脂界麵相互作用能幾乎沒有影響，而高溫和高濕都會使銅/環氧樹脂界麵黏結性能明顯下降。分析錶明，濕氣含量較高時，濕氣穿越環氧樹脂層聚集在銅與環氧樹脂之間。
채용분자동역학방법연구료전자봉장계면동/배양수지상호작용능，병고필배양수지교련정도、온도화함습량적영향。연구결과표명，배양수지교련정도대동/배양수지계면상호작용능궤호몰유영향，이고온화고습도회사동/배양수지계면점결성능명현하강。분석표명，습기함량교고시，습기천월배양수지층취집재동여배양수지지간。
The effects of crosslink conversion, temperature and moisture content on the interaction be-tween copper and epoxy were investigated by the molecular dynamics simulation. It was showed that the interaction energy of Cu/epoxy resin was almost independent of the crosslink conversion of the epoxy res-in, whereas it was weakened by increasing temperature and moisture content. Meanwhile, it was revealed that moisture concentrated at the Cu/epoxy interface. A comprehensive understanding of the interfacial degradation and a useful tool for developing new adhesives were provided.
