CAJ | 학술논문

为了改善SiCp 与Al基体之间的界面,在碱性条件下,甲醛作为还原剂,采用化学镀的方法在SiCp 表面沉积铜层,然后采用无压渗透方法制备SiCp/Al复合材料.采用X射线衍射仪、3D立体视频显微镜、扫描电子显微镜来分析化学镀后 SiCp 和复合材料的表面、界面形貌、组织结构及物相,并通过 EDS能谱对复合材料表面元素成分分析,利用激光闪光法测定复合材料导热系数.结果表明,相比酒石酸钾钠单一络合剂,采用酒石酸钾钠和 EDTA-2Na 组成的双络合剂的SiCp 镀层更致密,且镀层未被氧化,复合材料界面结合良好,界面厚度为2．5~3μm,有 AlCu2相生成,无Al4 C3脆性相存在.室温下,镀铜后的复合材料热导率达到181 W/(m·K),远高于没有表面改性的复合材料热导率102 W/(m·K).
위료개선SiCp 여Al기체지간적계면,재감성조건하,갑철작위환원제,채용화학도적방법재SiCp 표면침적동층,연후채용무압삼투방법제비SiCp/Al복합재료.채용X사선연사의、3D입체시빈현미경、소묘전자현미경래분석화학도후 SiCp 화복합재료적표면、계면형모、조직결구급물상,병통과 EDS능보대복합재료표면원소성분분석,이용격광섬광법측정복합재료도열계수.결과표명,상비주석산갑납단일락합제,채용주석산갑납화 EDTA-2Na 조성적쌍락합제적SiCp 도층경치밀,차도층미피양화,복합재료계면결합량호,계면후도위2．5~3μm,유 AlCu2상생성,무Al4 C3취성상존재.실온하,도동후적복합재료열도솔체도181 W/(m·K),원고우몰유표면개성적복합재료열도솔102 W/(m·K).
In order to improve the interface of between SiC particles and Al matrix,under alkaline condition,the surface of SiC particles was plated with Cu using electroless plating.Then SiCp/Al composites were prepared by pressureless infiltration technology.Surface and interface morphology,microstructure and phase of SiC particle and SiCp/Al composites were analyzed by X-ray diffraction,3D stereo video microscope and scanning electron microscope respectively.The surface element of SiC particles coating and composites was analyzed by EDS, meantime,thermal conductivity of SiCp/Al composites was measured by the laser flash method.The results show that,compared with a single KNaC4H4O6 ·4H2 O complexant,double complexants (KNaC4 H4 O6 · 4H2 O+EDTA-2Na)can more effectively plate a dense,no oxidation and good combined interface Cu coating on the surface of SiCp.The interface thickness of Cu was approximatively 2.5-3μm.AlCu2 phase was detected in the interface,however Al4 C3 brittle phase was not found.The thermal conductivity of SiCp/Al composites was 181 W/(m·K)at 20 ℃.It was much higher than that (102 W/(m·K))of SiCp/Al composites without sur-face modification of SiCp.