CAJ | 학술논문

目前,在各种刚挠结合板揭盖工艺中,激光控深揭盖以其成本低、速度快、流程简单、应用广泛,成为刚挠结合板揭盖工艺的主流.但是,在激光控深揭盖过程中,常会出现揭盖底部留铜无法阻挡激光,导致激光烧伤、击穿挠性板等品质不良现象.本文对刚挠结合板激光揭盖烧伤挠性板现象进行分析,通过对刚挠结合板的涨缩等方面进行研究,优化工艺设计,对刚挠结合板激光揭盖烧伤挠性板有着显著改善,有效控制挠性板损伤的不良问题.
목전,재각충강뇨결합판게개공예중,격광공심게개이기성본저、속도쾌、류정간단、응용엄범,성위강뇨결합판게개공예적주류.단시,재격광공심게개과정중,상회출현게개저부류동무법조당격광,도치격광소상、격천뇨성판등품질불량현상.본문대강뇨결합판격광게개소상뇨성판현상진행분석,통과대강뇨결합판적창축등방면진행연구,우화공예설계,대강뇨결합판격광게개소상뇨성판유착현저개선,유효공제뇨성판손상적불량문제.
At present, laser lid removing technology is the mainstream way in various methods of lid removing with its advantage in low cost, fast speed, simple process and widely used. But in the laser lid removing process, the remaining copper incapability of laser-blocking will probably occur, thus causing the undesirable defects such as laser burn and breakdown of flexible board. This paper analyses the phenomenon of flexible board damage in Rigid-Flex PCB laser lid removing, conducts research into expansion and contraction of Rigid-Flex PCB dimension first, and then optimizes the processing design, which realizes the significant improvement and effectivly controls in laser damage of Rigid-Flex PCB .