CAJ | 학술논문

本文首先简介了MEMS VOA芯片的研发历史,总结了现有各种此类芯片的特点和缺陷.然后介绍了一种新型的MEMS VOA芯片的设计思路和简要工艺流程,对新型芯片的测量表明衰减范围超过40dB, 响应时间小于1ms.和现有主流芯片相比,新型芯片的工艺流程对于设备要求低,制造成本低,响应时间快,抗冲击性能高.
본문수선간개료MEMS VOA심편적연발역사,총결료현유각충차류심편적특점화결함.연후개소료일충신형적MEMS VOA심편적설계사로화간요공예류정,대신형심편적측량표명쇠감범위초과40dB, 향응시간소우1ms.화현유주류심편상비,신형심편적공예류정대우설비요구저,제조성본저,향응시간쾌,항충격성능고.
The R&D history of MEMS chips applied in Telecom, especially the chips for VOA are reviewed, and the shortcoming of this kind of chips are summarized. A new type of chips for MEMS VOA, of which the design idea is pre-build-tilting- angle, is proposed. The fabrication process of the chips is introduced briefly. Packaged in device, the new type of chips shows the capability of more than 40dB attenuation range, with the response time of less then 1ms. Compared with the popular chips in the market, the new type of chips can be fabricated by standard equipment with high properties.