CAJ | 학술논문

采用离子交换法处理集成电路封装去胶产生的有机废水. 静态实验研究结果表明,弱酸型阳离子交换树脂OD5对该废水中的有机物具有吸附容量大、再生性能好等特点. 废水经10.0 g树脂吸附后,COD从760.0 mg/L降至272.6 mg/L;再经芬顿氧化,废水COD降至55.2 mg/L , COD总去除率达到92.7%. 吸附动力学研究表明,OD5树脂吸附COD受内扩散控制,吸附速率常数为k=7.6 ×10?3 min?1 .
채용리자교환법처리집성전로봉장거효산생적유궤폐수. 정태실험연구결과표명,약산형양리자교환수지OD5대해폐수중적유궤물구유흡부용량대、재생성능호등특점. 폐수경10.0 g수지흡부후,COD종760.0 mg/L강지272.6 mg/L;재경분돈양화,폐수COD강지55.2 mg/L , COD총거제솔체도92.7%. 흡부동역학연구표명,OD5수지흡부COD수내확산공제,흡부속솔상수위k=7.6 ×10?3 min?1 .
Ion exchange processing was adopted to treat organic wastewater produced by integrated circuit packaging industry. Static experiment research results show that weak acid cation resin OD5 has a large adsorption capacity for organic matter and good regeneration performance. After absorption by 10.0g resin, the concentration of COD in the wastewater dropped from 760.0mg/L to 272.6mg/L; after Fenton oxidation, the concentration of COD further dropped to 55.2mg/L. The total removal rate of COD was up to 92.7%. Adsorption kinetics research shows that the adsorption of COD by OD5 resin is controlled by internal diffusion and the adsorption rate constant is k=7.6 ×10?3 min?1 .