上海涂料
上海塗料
상해도료
Shanghai Coatings
2015年
8期
7-11
,共5页
黄月文%王斌%郑周%张伟
黃月文%王斌%鄭週%張偉
황월문%왕빈%정주%장위
乙烯基甲基MQ硅树脂%杂化%导热涂料
乙烯基甲基MQ硅樹脂%雜化%導熱塗料
을희기갑기MQ규수지%잡화%도열도료
viny methyl MQ silicone resin%hybridization%thermal conductivity coatings
采用物理方法将烯丙基缩水甘油醚、纳米乙烯基甲基MQ硅树脂(VMQ)、硅烷偶联剂KH560和改性微米级导热氮化硼(BN)填料混杂分散在低黏度端乙烯基甲基硅油中,通过交联剂含氢甲基硅油、抑制剂乙炔基环己醇及Karstedt催化剂,制成室温流动性好、操作时间长的无溶剂型双组分BN/环氧/VMQ杂化聚硅氧烷涂料,并探讨了涂料的交联固化成膜机理.试验结果表明:通过VMQ改性的聚硅氧烷涂膜,拉伸强度和粘接强度显著提高,再经环氧改性后的粘接强度可进一步提高到1.2 MPa;随着BN掺量的增加,涂膜的导热率大幅提升.当乙烯基硅油质量为100份、VMQ为90份、烯丙基缩水甘油醚为2份和BN为60份时,热固化形成的杂化聚硅氧烷涂膜导热率可达到1.6 W/(m·K),失重10%时的温度可达631 K.
採用物理方法將烯丙基縮水甘油醚、納米乙烯基甲基MQ硅樹脂(VMQ)、硅烷偶聯劑KH560和改性微米級導熱氮化硼(BN)填料混雜分散在低黏度耑乙烯基甲基硅油中,通過交聯劑含氫甲基硅油、抑製劑乙炔基環己醇及Karstedt催化劑,製成室溫流動性好、操作時間長的無溶劑型雙組分BN/環氧/VMQ雜化聚硅氧烷塗料,併探討瞭塗料的交聯固化成膜機理.試驗結果錶明:通過VMQ改性的聚硅氧烷塗膜,拉伸彊度和粘接彊度顯著提高,再經環氧改性後的粘接彊度可進一步提高到1.2 MPa;隨著BN摻量的增加,塗膜的導熱率大幅提升.噹乙烯基硅油質量為100份、VMQ為90份、烯丙基縮水甘油醚為2份和BN為60份時,熱固化形成的雜化聚硅氧烷塗膜導熱率可達到1.6 W/(m·K),失重10%時的溫度可達631 K.
채용물리방법장희병기축수감유미、납미을희기갑기MQ규수지(VMQ)、규완우련제KH560화개성미미급도열담화붕(BN)전료혼잡분산재저점도단을희기갑기규유중,통과교련제함경갑기규유、억제제을결기배기순급Karstedt최화제,제성실온류동성호、조작시간장적무용제형쌍조분BN/배양/VMQ잡화취규양완도료,병탐토료도료적교련고화성막궤리.시험결과표명:통과VMQ개성적취규양완도막,랍신강도화점접강도현저제고,재경배양개성후적점접강도가진일보제고도1.2 MPa;수착BN참량적증가,도막적도열솔대폭제승.당을희기규유질량위100빈、VMQ위90빈、희병기축수감유미위2빈화BN위60빈시,열고화형성적잡화취규양완도막도열솔가체도1.6 W/(m·K),실중10%시적온도가체631 K.
A novel solventless two component hybrid polysiloxane coatings with good fluidity and long operation time at room temperature was prepared by physically mixing low initial viscosity terminated-vinyl methyl silicone oil with allyl glycidyl ether,nano-scale vinyl methyl MQ silicone resin(VMQ),KH560 silane coupling agent and modified micro-scale thermal-conductivity BN filler,then reaction with crossing-linking agent hydrogen containing methyl silicone oil,inhibitor ethynylcyclohexanol and catalyst Karstedt. The crosslinking curing mechanism of coatings was investigated. The tensile and adhesion strength of polysiloxane film modified by VMQ were improved, and the adhesion strength distinctively reached 1.2 MPa with the modification of epoxy. With increasing of addition of BN,thermal conductivity of the film would be greatly promoted. The heat curing film had the coefficient of heat conductivity 1.6 W/(m·K)and the decomposition temperature of 10% mass loss 631K when the composition of vinyl methyl silicone oil 100,VMQ 90,allyl glycidyl ether 2 and BN 60.