印制电路信息
印製電路信息
인제전로신식
Printed Circuit Information
2015年
9期
32-37
,共6页
朱拓%邝许平%何淼%阙玉龙
硃拓%鄺許平%何淼%闕玉龍
주탁%광허평%하묘%궐옥룡
挠性板%形变%层压
撓性闆%形變%層壓
뇨성판%형변%층압
Flexible Board%Deformation%Lamination
由于挠性板的尺寸稳定性难于掌控,以及刚挠结合板中挠性和刚性部分的性能差异较大,使得在层压过程中经常出现挠性区和刚性区的涨缩不一致而导致内层短路的缺陷。文章详细分析了挠性板在层压过程中的具体形变过程及影响因素。
由于撓性闆的呎吋穩定性難于掌控,以及剛撓結閤闆中撓性和剛性部分的性能差異較大,使得在層壓過程中經常齣現撓性區和剛性區的漲縮不一緻而導緻內層短路的缺陷。文章詳細分析瞭撓性闆在層壓過程中的具體形變過程及影響因素。
유우뇨성판적척촌은정성난우장공,이급강뇨결합판중뇨성화강성부분적성능차이교대,사득재층압과정중경상출현뇨성구화강성구적창축불일치이도치내층단로적결함。문장상세분석료뇨성판재층압과정중적구체형변과정급영향인소。
This paper introduced the difficulty of controlling the dimension stability of flexible board, and the large difference of performance between flexible and rigid board, which cause a defect of short-circuit exists in the inner layer of rigid-flex PCB in the lamination process. In this paper, the deformation of flexible board and its influence factors were analyzed specifically during lamination process.