CAJ | 학술논문

在苯并噁嗪/环氧树脂两元体系中,加入不同比例的酚醛树脂,研究其反应动力学及流变特性.采用该体系为基体制备了覆铜板,并对覆铜板的耐热性、吸水率及介电性能进行测试.结果表明:提高酚醛树脂的含量,有利于降低反应体系的固化温度,提高覆铜板的热失重温度(Td5%);但随着酚醛树脂含量的增加,体系的介电性能下降,玻璃化转变温度(Tg)呈现先上升后下降的趋势,吸水率呈先下降后上升的趋势.当酚醛树脂含量达到12%时,体系的综合性能最佳,其Tg达到204℃,高压蒸煮(PCT)吸水率为0.44%,且加工窗口较宽.
재분병오진/배양수지량원체계중,가입불동비례적분철수지,연구기반응동역학급류변특성.채용해체계위기체제비료복동판,병대복동판적내열성、흡수솔급개전성능진행측시.결과표명:제고분철수지적함량,유리우강저반응체계적고화온도,제고복동판적열실중온도(Td5%);단수착분철수지함량적증가,체계적개전성능하강,파리화전변온도(Tg)정현선상승후하강적추세,흡수솔정선하강후상승적추세.당분철수지함량체도12%시,체계적종합성능최가,기Tg체도204℃,고압증자(PCT)흡수솔위0.44%,차가공창구교관.
The different contents of phenolic resin were added into benzoxazine/epoxy resin binary system, and its curing reaction kinetics and rheology behavior were stutied. A copper clad laminate (CCL) was prepared using this system as matrix, and its thermal stability, water absorption, and dielec-tric properties were tested. The results show that the increase of phenolic resin content could decrease the curing temperature of the resin system and raise the thermal decompositon temperature (Td5%) of the CCL. With the increase of phenolic resin content, the dielectric properties decrease, the glass transition temperature (Tg) increase first and then decrease, and the water absorption decrease first and then increase. When the phenolic resin content reaches 12%, the system has the best comprehensive property, the Tg reaches 204℃, the water absorption is 0.44%, and the processing window is wide.