CAJ | 학술논문

建立了5×5 AlGaInP材料LED微阵列的有限元热分析模型，根据计算对模型进行了简化。结果表明，简化模型与原始模型的温度分布规律基本一致，计算得到的两种模型在工作1.5 s时的温度相对误差为0.8%。使用简化模型模拟了含104个单元、尺寸为10 mm ×10 mm ×100μm的芯片的温度场分布，工作1.5 s时的芯片中心温度已达到360.6℃。为解决其散热问题，设计了两种散热器，并对其结构进行了优化，分析了翅片数量、翅片尺寸、粘结材料对芯片温度的影响。
건립료5×5 AlGaInP재료LED미진렬적유한원열분석모형，근거계산대모형진행료간화。결과표명，간화모형여원시모형적온도분포규률기본일치，계산득도적량충모형재공작1.5 s시적온도상대오차위0.8%。사용간화모형모의료함104개단원、척촌위10 mm ×10 mm ×100μm적심편적온도장분포，공작1.5 s시적심편중심온도이체도360.6℃。위해결기산열문제，설계료량충산열기，병대기결구진행료우화，분석료시편수량、시편척촌、점결재료대심편온도적영향。
A finite element thermal analysis model of 5 × 5 AlGaInP-based LED microarray was established and simplified according to the calculation results. The results show that the simplified model and original model have the same temperature distribution, relative error of simplified model is 0. 8% at 1. 5 s. Using the simplified model, the temperature distribution of the chip with the size of 10 mm × 10 mm × 100 μm and 104 units was calculated, and the center temperature of chip reached 360. 6 ℃ at 1. 5 s. In order to solve the problem of heat dissipation, two finned radiators were designed, and the impacts of radiator structure, adhesive material, and number of fins on the temperature of chip were simulated.