CAJ | 학술논문

热电交互作用下产生的电迁移现象成为倒装芯片封装关键的可靠性问题。建立了FCBGA（倒装芯片球栅陈列封装）三维封装模型，研究了热-电交互作用下倒装芯片互连结构中的温度分布、电流密度分布以及焦耳热分布；发现焊料凸点中存在严重的焦耳热和电流聚集现象；分析了焊料凸点中热点出现的原因，并发现热点在焊料凸点空洞形成过程中起到了关键作用。
열전교호작용하산생적전천이현상성위도장심편봉장관건적가고성문제。건립료FCBGA（도장심편구책진렬봉장）삼유봉장모형，연구료열-전교호작용하도장심편호련결구중적온도분포、전류밀도분포이급초이열분포；발현한료철점중존재엄중적초이열화전류취집현상；분석료한료철점중열점출현적원인，병발현열점재한료철점공동형성과정중기도료관건작용。
Electro-migration induced by thermoelectric interaction is a very important reliability problem for flip chip packages. 3D model of FCBGA was established. The distributions of temperature, current density, Joule heat in flip chip solder joints under thermoelectric interaction were researched. It is found that there is serious Joule heat and current crowding phenomenons. The reason that hot-spot occurred was analyzed. It is found that hot spots play a key role in the development of cavity in the solder bumps.