电子元件与材料
電子元件與材料
전자원건여재료
Electronic Components & Materials
2015年
10期
88-90,94
,共4页
SnBi-xNi%钎料%塑性%硬度%弹性模量%纳米压痕
SnBi-xNi%釬料%塑性%硬度%彈性模量%納米壓痕
SnBi-xNi%천료%소성%경도%탄성모량%납미압흔
SnBi-xNi%solder%plasticity%hardness%elastic modulus%nanoindentation
借助纳米压痕的方法，采用压痕形成过程中塑性应变与总应变的比值来表征钎料塑性。对SnBi-xNi(x=0，0.05，0.1，0.15和0.2)成分钎料的硬度、弹性模量及塑性进行了对比。结果表明：Sn58Bi钎料合金加入Ni元素后，钎料硬度和弹性模量升高。当Sn58Bi-xNi钎料中Ni 含量的质量分数为0.1%时，其硬度及弹性模量最大。当Ni质量分数超过0.1%时，钎料的硬度与弹性模量有所下降。当添加Ni元素质量分数为0.05%~0.1%时，钎料合金的组织得到了细化，钎料合金的塑性提高；当Ni质量分数大于0.15%时，钎料的塑性降低。
藉助納米壓痕的方法，採用壓痕形成過程中塑性應變與總應變的比值來錶徵釬料塑性。對SnBi-xNi(x=0，0.05，0.1，0.15和0.2)成分釬料的硬度、彈性模量及塑性進行瞭對比。結果錶明：Sn58Bi釬料閤金加入Ni元素後，釬料硬度和彈性模量升高。噹Sn58Bi-xNi釬料中Ni 含量的質量分數為0.1%時，其硬度及彈性模量最大。噹Ni質量分數超過0.1%時，釬料的硬度與彈性模量有所下降。噹添加Ni元素質量分數為0.05%~0.1%時，釬料閤金的組織得到瞭細化，釬料閤金的塑性提高；噹Ni質量分數大于0.15%時，釬料的塑性降低。
차조납미압흔적방법，채용압흔형성과정중소성응변여총응변적비치래표정천료소성。대SnBi-xNi(x=0，0.05，0.1，0.15화0.2)성분천료적경도、탄성모량급소성진행료대비。결과표명：Sn58Bi천료합금가입Ni원소후，천료경도화탄성모량승고。당Sn58Bi-xNi천료중Ni 함량적질량분수위0.1%시，기경도급탄성모량최대。당Ni질량분수초과0.1%시，천료적경도여탄성모량유소하강。당첨가Ni원소질량분수위0.05%~0.1%시，천료합금적조직득도료세화，천료합금적소성제고；당Ni질량분수대우0.15%시，천료적소성강저。
By using nanoindentation method, the ratio of plastic strain to total strain was used to characterize the solder plasticity. The hardness, modulus of elasticity and plasticity of SnBi-xNi (x=0, 0.05, 0.1, 0.15 and 0.2) solder alloy were compared. The results show that the hardness and elastic modulus of Sn58Bi solder alloy increase after adding Ni. The solder hardness and elastic modulus reach the maximum values when 0.1% ofw(Ni) is added. Whenw(Ni) is more than 0.1%, the hardness and elastic modulus of SnBi-xNi solder alloy decline. With 0.05%–0.1% ofw(Ni) adding in SnBi solder alloy, the organization of solder alloys is refined, and the solder alloys plasticity is improved. Whenw(Ni) is higher than 0.15%, the solder alloy plasticity is reduced.
