电子工艺技术
電子工藝技術
전자공예기술
Electronics Process Technology
2015年
5期
295-298
,共4页
TR组件%电子装联%微波基板
TR組件%電子裝聯%微波基闆
TR조건%전자장련%미파기판
T/R module%Electronics assembly%Micro-wave base board
随着TR组件工作频率和集成度越来越高,其组装工艺可靠性的要求也越来越高。TR组件的组装涉及微波基板上多种封装元器件在印制板上的装焊和印制板与屏蔽盒体的组装。通过工艺试验,从工艺流程设定和重要工序工艺参数设置,介绍了一种组装工艺。产品测试结果表明,组装工艺满足要求,保证了产品质量的可靠性。
隨著TR組件工作頻率和集成度越來越高,其組裝工藝可靠性的要求也越來越高。TR組件的組裝涉及微波基闆上多種封裝元器件在印製闆上的裝銲和印製闆與屏蔽盒體的組裝。通過工藝試驗,從工藝流程設定和重要工序工藝參數設置,介紹瞭一種組裝工藝。產品測試結果錶明,組裝工藝滿足要求,保證瞭產品質量的可靠性。
수착TR조건공작빈솔화집성도월래월고,기조장공예가고성적요구야월래월고。TR조건적조장섭급미파기판상다충봉장원기건재인제판상적장한화인제판여병폐합체적조장。통과공예시험,종공예류정설정화중요공서공예삼수설치,개소료일충조장공예。산품측시결과표명,조장공예만족요구,보증료산품질량적가고성。
The requirement on assembly process reliability of TR module is also gradually increasing, with the trend of the increasing working frequency, increasing integration and gradual miniaturization of TR module. TR module assembly relates to the soldering assembly of multiplicate packages micro-chip components on printed circuit and the assembly of printed circuits in the shielding box. Through the process test, an assembling process is introduced to ensure the reliability of the above-mentioned two processes, from technological process setting and technological parameters setting of important processes. The assembling process is showed to meet the requirements by test results of the products.