CAJ | 학술논문

在常规通孔插装器件焊接工艺的基础上，增加底风预热系统，实现军用短引脚陶瓷封装针栅阵列（CPGA）的高可靠性手工组装。以通孔透锡率和焊点气泡率为判据，探讨了底风预热系统、烙铁头选择以及助焊剂使用对焊点结构的影响规律，最终确定适用于短引脚CPGA的手工装联工艺技术。
재상규통공삽장기건한접공예적기출상，증가저풍예열계통，실현군용단인각도자봉장침책진렬（CPGA）적고가고성수공조장。이통공투석솔화한점기포솔위판거，탐토료저풍예열계통、락철두선택이급조한제사용대한점결구적영향규률，최종학정괄용우단인각CPGA적수공장련공예기술。
The high reliability soldering process of military short lead ceramic pin grid array (CPGA) was achieved by adding bottom wind pre-heating system on the basis of normal THT soldering technology. The THT iflling rate and void rate were used as the inspect standard, in order to investigate the inlfuence of pre-heating system, soldering iron head and lfux on THT solder joint structure. The suitable hand soldering technology for the short lend CPGA was determined ifnally.