CAJ | 학술논문

目的：( Ti,Cu) N薄膜是一种新型的硬质涂层材料,关于其结构和性能的研究报道还较少。研究脉冲偏压对( Ti,Cu) N薄膜结构与性能的影响规律,以丰富该研究领域的成果。方法将多弧离子镀和磁控溅射离子镀相结合构成复合离子镀技术,采用该技术在不同脉冲偏压下于高速钢基体表面制备( Ti,Cu) N薄膜。分析薄膜的微观结构,测定沉积速率及薄膜显微硬度,通过摩擦磨损实验测定薄膜的摩擦系数。结果在不同偏压下获得的(Ti,Cu)N薄膜均呈晶态,具有(200)晶面择优取向,当脉冲偏压为-300 V时,薄膜的择优程度最明显。随着脉冲偏压的增加,薄膜表面大颗粒数量减少且尺寸变小,表面质量提高；沉积速率呈现先增大、后减小的趋势,在脉冲偏压为-400 V时最大,达到25.04 nm/min；薄膜硬度也呈现先增大、后减小的趋势,在脉冲偏压为-300 V时达到最大值1571.4 HV。结论脉冲偏压对复合离子镀( Ti,Cu) N薄膜的表面形貌、择优取向、沉积速率和硬度均有影响。
목적：( Ti,Cu) N박막시일충신형적경질도층재료,관우기결구화성능적연구보도환교소。연구맥충편압대( Ti,Cu) N박막결구여성능적영향규률,이봉부해연구영역적성과。방법장다호리자도화자공천사리자도상결합구성복합리자도기술,채용해기술재불동맥충편압하우고속강기체표면제비( Ti,Cu) N박막。분석박막적미관결구,측정침적속솔급박막현미경도,통과마찰마손실험측정박막적마찰계수。결과재불동편압하획득적(Ti,Cu)N박막균정정태,구유(200)정면택우취향,당맥충편압위-300 V시,박막적택우정도최명현。수착맥충편압적증가,박막표면대과립수량감소차척촌변소,표면질량제고；침적속솔정현선증대、후감소적추세,재맥충편압위-400 V시최대,체도25.04 nm/min；박막경도야정현선증대、후감소적추세,재맥충편압위-300 V시체도최대치1571.4 HV。결론맥충편압대복합리자도( Ti,Cu) N박막적표면형모、택우취향、침적속솔화경도균유영향。
Objective There are few reports on the microstructure and properties of ( Ti,Cu) N thin film, which is a new type of hard coating. This work investigated the effects of pulsed bias on the structure and properties of ( Ti,Cu) N film, enriching research results of this area. Methods The hybrid ion plating technique, realized by simultaneously using arc ion plating and magnetron sputtering, was employed to deposit ( Ti,Cu) N film samples onto high-speed steel under different pulsed biases. Surface morpholo-gy, crystalline structure, thickness, micro-hardness as well as friction coefficient of the coatings were measured respectively. Results All the films were crystalline in spite of the varying bias. The ( Ti,Cu) N coatings deposited at-300 V had the most obvi-ous preferred plane (200). Both the quantity and the size of the macro-particles on the film surface became smaller with the in-creasing pulsed bias, presenting an improved surface quality. Deposition rate of the ( Ti,Cu) N film increased first and then de-creased with increasing pulsed bias, and the maximum deposition rate, 25. 04 nm/min, was achieved at a pulsed bias of-400 V. Micro-hardness of the films changed similarly to the deposition rate with the varying pulsed bias, and it reached the maximum value of 1571. 4HV at-300 V. Conclusion The pulsed bias had an obvious influence on the surface morphology, crystalline orientation, deposition rate and microhardness of ( Ti,Cu) N films.