CAJ | 학술논문

低温共烧陶瓷（LTCC）技术是最近几年发展起来令人瞩目的电路封装技术，其质料从简略到复合、从低介电常数到高介电常数的不竭发展，技术的成熟水平、产业化水平及利用普遍水平等角度不竭增添。L T CC技术已经成为无源集成的主流技术，亦是无源元件的领域发展方向和新型电子元器件模块化主要技术之一。为迎合目前的发展趋势，本文论述了LTCC材料、LTCC技术和LTCC器件的应用以及未来市场前景。
저온공소도자（LTCC）기술시최근궤년발전기래령인촉목적전로봉장기술，기질료종간략도복합、종저개전상수도고개전상수적불갈발전，기술적성숙수평、산업화수평급이용보편수평등각도불갈증첨。L T CC기술이경성위무원집성적주류기술，역시무원원건적영역발전방향화신형전자원기건모괴화주요기술지일。위영합목전적발전추세，본문논술료LTCC재료、LTCC기술화LTCC기건적응용이급미래시장전경。
The low temperature cofired ceramic (LTCC)technology .Its developed in recent years re‐markable circuit packaging technology .Its material from simple to complex ,from low dielectric con‐stant maturity level to a high dielectric constant inexhaustible development ,technology ,the level of in‐dustrialization and the use of the general level of the angle of the endless growth .LTCC technology has become the mainstream of passive integration technology .It is also the field of passive components and the development direction of new electronic components modular one of the main technologies .In order to meet the current development trend ,the paper discusses the LTCC materials ,applications and future market prospects and LTCC technology devices .