印制电路信息
印製電路信息
인제전로신식
Printed Circuit Information
2015年
10期
42-44,70
,共4页
层压板%高漏电起痕指数%耐热性%多层板
層壓闆%高漏電起痕指數%耐熱性%多層闆
층압판%고루전기흔지수%내열성%다층판
Laminate%High CTI%Thermal Reliability%Multilayer Board
章通过树脂体系改进开发一种新型高热可靠性高CTI板材并重点介绍板材开发中设计思路板材性能以及多层板应情况。
章通過樹脂體繫改進開髮一種新型高熱可靠性高CTI闆材併重點介紹闆材開髮中設計思路闆材性能以及多層闆應情況。
장통과수지체계개진개발일충신형고열가고성고CTI판재병중점개소판재개발중설계사로판재성능이급다층판응정황。
With the improved resin system, the type of thermal reliability high CTI laminate has been development. The design ideas of development, laminate performance and multilayer applications were introduced.
