印制电路信息
印製電路信息
인제전로신식
Printed Circuit Information
2015年
10期
10-15,48
,共7页
ITRS 2010路线图%高密度%集肤效应%积层式PCB%无芯板积层式PCB
ITRS 2010路線圖%高密度%集膚效應%積層式PCB%無芯闆積層式PCB
ITRS 2010로선도%고밀도%집부효응%적층식PCB%무심판적층식PCB
ITRS 2010 ROAD MAP%High Density%Skin-Effect%Built-up PCB%Coreless Built-up PCB
随着半导体芯片向微细化多端子高化电子产品向轻薄小高性能多功能方向发展要求采 PCB及电子封装与之匹配进而对二者在形式结构作方法加工工艺特别是材方面提出越来越高要求章介绍印电路板和电子封装技术最新发展动向。
隨著半導體芯片嚮微細化多耑子高化電子產品嚮輕薄小高性能多功能方嚮髮展要求採 PCB及電子封裝與之匹配進而對二者在形式結構作方法加工工藝特彆是材方麵提齣越來越高要求章介紹印電路闆和電子封裝技術最新髮展動嚮。
수착반도체심편향미세화다단자고화전자산품향경박소고성능다공능방향발전요구채 PCB급전자봉장여지필배진이대이자재형식결구작방법가공공예특별시재방면제출월래월고요구장개소인전로판화전자봉장기술최신발전동향。
Along with the development of IC chip to fine pitch, more I/O pins ,high speed, as well as the electronic products to be lighter, thinner, smaller, with high properties and more performance, it is necessary for PCB and electronic package to match IC Chip and electronic products. Therefore the requirements to PCB and electronic package in the forms, structures, manufacture processes and technologies, particularly in the used materials, are more and more high. This paper introduces recent development trend of technologies.
