印制电路信息
印製電路信息
인제전로신식
Printed Circuit Information
2015年
10期
59-63
,共5页
深镀能力%电镀铜消耗%哈林槽
深鍍能力%電鍍銅消耗%哈林槽
심도능력%전도동소모%합림조
Deep Plating Ability%Electroplating Copper Consumption%Haring Cell
单位产品铜消耗量是PCB行要成之一它与成增加成正相关关系因此降低单位产品铜消耗量就成为线路板厂家努力方向根 IPC标准孔中最小铜厚必须18μm 章采实验室哈林槽试验办法来模拟电镀铜生产线实际情况探影响深镀能力各种因素通过提高线路板电镀铜深镀能力在维持孔内最小铜厚前提下降低单位产品铜消耗从而压低生产成。
單位產品銅消耗量是PCB行要成之一它與成增加成正相關關繫因此降低單位產品銅消耗量就成為線路闆廠傢努力方嚮根 IPC標準孔中最小銅厚必鬚18μm 章採實驗室哈林槽試驗辦法來模擬電鍍銅生產線實際情況探影響深鍍能力各種因素通過提高線路闆電鍍銅深鍍能力在維持孔內最小銅厚前提下降低單位產品銅消耗從而壓低生產成。
단위산품동소모량시PCB행요성지일타여성증가성정상관관계인차강저단위산품동소모량취성위선로판엄가노력방향근 IPC표준공중최소동후필수18μm 장채실험실합림조시험판법래모의전도동생산선실제정황탐영향심도능력각충인소통과제고선로판전도동심도능력재유지공내최소동후전제하강저단위산품동소모종이압저생산성。
Copper consumption per unit product of is one of the main sources for the PCB industry cost. It is almost positively correlated to the increase of costs, thus reducing the unit product of copper consumption has become the direction of the circuit board manufacturers. According to the IPC standard, 18 microns copper thickness must be plated above the hole. The laboratory haring cell test method is to simulate the actual situation of the copper electroplating production line, to investigate the infiuence of deep plating ability of various factors. By improving the circuit board copper electroplating deep plating ability under the premise of maintaining the inner hole of the minimum copper thickness, we can reduce the unit product of copper consumption, and thus lower the production cost.
