CAJ | 학술논문

电子设备的功率器件和散热冷板之间由于存在面积差异,产生扩展热阻,在高热流密度条件下( >100 W/cm2 )温升效应尤为明显. 文中通过对固态T/R组件冷板扩展热阻的简化近似解的分析计算,研究了冷板的导热系数、厚度、半径、对流换热系数等参数扩展热阻的影响规律,发现冷板存在厚度和半径的工程最优值使得扩展热阻或总热阻最小,建立了相应的尺寸优化准则,然后通过计算流体力学( computiatonal fluid dynamics ,CFD)数值试验进行了计算验证,结果表明CFD解和简化解结果一致,研究结论可用于指导冷板或热扩展板的工程设计.
전자설비적공솔기건화산열랭판지간유우존재면적차이,산생확전열조,재고열류밀도조건하( >100 W/cm2 )온승효응우위명현. 문중통과대고태T/R조건랭판확전열조적간화근사해적분석계산,연구료랭판적도열계수、후도、반경、대류환열계수등삼수확전열조적영향규률,발현랭판존재후도화반경적공정최우치사득확전열조혹총열조최소,건립료상응적척촌우화준칙,연후통과계산류체역학( computiatonal fluid dynamics ,CFD)수치시험진행료계산험증,결과표명CFD해화간화해결과일치,연구결론가용우지도랭판혹열확전판적공정설계.
The spreading thermal resistance caused by the area difference between the electronic device and the cooling plate is sig -nificantly high when the heat flux density is higher than 100 W/cm2 .In this paper , the thermal spreading resistance of the solid-state T/R module cold plate was modeled and simulated with a simplified analytical method , and then the effect of heat transfer co-efficient, thickness, radius, heat transfer coefficient of the cold plate was studied .The optimal combination of parameters , such as, the radius and the thickness was obtained , with which the spreading thermal resistance and the total heat transfer resistance was minimum.Finally, the present model was validated with a CFD simulation , with a reasonable match obtained , which proved the present work as a solid reference of relevant applications