上海第二工业大学学报
上海第二工業大學學報
상해제이공업대학학보
Journal of Shanghai Second Polytechnic University
2015年
3期
201-204
,共4页
赵颖璠%张承龙%王鹏程%王景伟%白建峰
趙穎璠%張承龍%王鵬程%王景偉%白建峰
조영번%장승룡%왕붕정%왕경위%백건봉
废弃印刷线路板%银%络合%浸出
廢棄印刷線路闆%銀%絡閤%浸齣
폐기인쇄선로판%은%락합%침출
waste printed circuit boards%silver%complexation%leaching
用络合法浸出废弃印刷线路板元器件中的金属银.主要研究了络合剂浓度、氧化剂浓度、反应温度、浸出时间对浸出效果的影响,使用电感耦合等离子体原子发射光谱法对样品进行分析.实验结果表明,废弃印刷线路板元器件中金属银的最佳浸出条件为:络合剂浓度25 g/L,氧化剂质量分数30%,反应时间2 h,反应温度308 K,浸出率达到80.95%.
用絡閤法浸齣廢棄印刷線路闆元器件中的金屬銀.主要研究瞭絡閤劑濃度、氧化劑濃度、反應溫度、浸齣時間對浸齣效果的影響,使用電感耦閤等離子體原子髮射光譜法對樣品進行分析.實驗結果錶明,廢棄印刷線路闆元器件中金屬銀的最佳浸齣條件為:絡閤劑濃度25 g/L,氧化劑質量分數30%,反應時間2 h,反應溫度308 K,浸齣率達到80.95%.
용락합법침출폐기인쇄선로판원기건중적금속은.주요연구료락합제농도、양화제농도、반응온도、침출시간대침출효과적영향,사용전감우합등리자체원자발사광보법대양품진행분석.실험결과표명,폐기인쇄선로판원기건중금속은적최가침출조건위:락합제농도25 g/L,양화제질량분수30%,반응시간2 h,반응온도308 K,침출솔체도80.95%.
The complexant was used to leach silver in components from waste printed circuit boards. It is focused on how the concen-tration of complexing agent and oxidant, reaction temperature, leaching time effect the leaching of silver. The samples were analyzed by inductively coupled plasma atomic emission spectrometry. It can be concluded that the optimum leaching conditions of silver from waste printed circuit boards' components was complexing agent concentration 25 g/L, oxidant concentration 24%, reaction time 2 h, reaction temperature 310 K.