电子元件与材料
電子元件與材料
전자원건여재료
Electronic Components & Materials
2015年
11期
96-99
,共4页
叠层焊点%PBGA%温度场%ANSYS%有限元法%封装
疊層銲點%PBGA%溫度場%ANSYS%有限元法%封裝
첩층한점%PBGA%온도장%ANSYS%유한원법%봉장
stacked solder joints%PBGA%temperature field%ANSYS%FEM%package
运用有限元软件ANSYS建立了采用叠层焊点的塑料球栅阵列(Plastic Ball Grid Array，PBGA)结构有限元分析模型，基于该模型对PBGA结构在典型工作环境下的稳态温度场分布进行了模拟，对比传统单层焊点与叠层焊点对 PBGA结构温度场的影响，并分析了焊点高度和 PBGA结构各部分材料导热系数对内部温度的影响。结果表明：焊点结构形式（单层和叠层）和焊点高度对PBGA组件温度场影响不大；PCB的导热系数对PBGA组件温度场影响最大，其次是塑封和基板，粘结剂对PBGA组件温度场影响很小。
運用有限元軟件ANSYS建立瞭採用疊層銲點的塑料毬柵陣列(Plastic Ball Grid Array，PBGA)結構有限元分析模型，基于該模型對PBGA結構在典型工作環境下的穩態溫度場分佈進行瞭模擬，對比傳統單層銲點與疊層銲點對 PBGA結構溫度場的影響，併分析瞭銲點高度和 PBGA結構各部分材料導熱繫數對內部溫度的影響。結果錶明：銲點結構形式（單層和疊層）和銲點高度對PBGA組件溫度場影響不大；PCB的導熱繫數對PBGA組件溫度場影響最大，其次是塑封和基闆，粘結劑對PBGA組件溫度場影響很小。
운용유한원연건ANSYS건립료채용첩층한점적소료구책진렬(Plastic Ball Grid Array，PBGA)결구유한원분석모형，기우해모형대PBGA결구재전형공작배경하적은태온도장분포진행료모의，대비전통단층한점여첩층한점대 PBGA결구온도장적영향，병분석료한점고도화 PBGA결구각부분재료도열계수대내부온도적영향。결과표명：한점결구형식（단층화첩층）화한점고도대PBGA조건온도장영향불대；PCB적도열계수대PBGA조건온도장영향최대，기차시소봉화기판，점결제대PBGA조건온도장영향흔소。
The steady-state temperature distribution under the typical operating environment of plastic ball grid array (PBGA) using stacked solder joints was analyzed based on the method of finite element software ANSYS analysis simulation. The influence of traditional singleply and stacked solder joints on PBGA assembly temperature field was compared, and the influence of solder joint height and various parts of PBGA component thermal conductivity on the internal temperature was analyzed. Results show that the solder joint structure (single and stacked) and the height of solder joint have little effect on the temperature field of PBGA components; the thermal conductivity of PCB has the largest effect on temperature field of PBGA assembly, followed by plastic package and substrate, the adhesive has little effect on PBGA component temperature field.
