CAJ | 학술논문

从子板PCB设计、芯片粘接、优化引线键合参数方面对SOI像素探测器的COB组装工艺做了初步研究。基板焊盘表面处理选用了电镀化学镍钯金的工艺，并对焊盘排布方式做了改进；芯片粘接选用了导电环氧树脂胶，探讨了水平定位误差和垂直定位误差对键合的影响及处理方法；通过反复试验和不断优化得出一套引线键合优化参数。对子板模块性能测试表明：其噪声和漏电流水平均保持在合理范围。 COB组装技术可为后续的硅像素探测器芯片拼接提供技术支撑。
종자판PCB설계、심편점접、우화인선건합삼수방면대SOI상소탐측기적COB조장공예주료초보연구。기판한반표면처리선용료전도화학얼파금적공예，병대한반배포방식주료개진；심편점접선용료도전배양수지효，탐토료수평정위오차화수직정위오차대건합적영향급처리방법；통과반복시험화불단우화득출일투인선건합우화삼수。대자판모괴성능측시표명：기조성화루전류수평균보지재합리범위。 COB조장기술가위후속적규상소탐측기심편병접제공기술지탱。
This article introduces a COB assembly process for the SOI pixel detectors , including the design of PCB boards , die attachment , and optimization of wire bonding parameters .The bonding pads were treated by depositing additional layers of nickel , palladium and gold .The layout of pads on PCB was also improved to fa-cilitate the wire bonding operation .Conductive epoxy was used to glue the SOI chip and PCB substrate togeth-er.A short discussion on the misalignment of die attachment is given .A set of wire bonding parameters was ob-tained through careful tuning .A performance measurement on the COB -assembled board showed that its noise and leakage are well -controlled .This technology provided a solid basis for further multi -chip assembly .