电子元件与材料
電子元件與材料
전자원건여재료
Electronic Components & Materials
2015年
11期
5-10
,共6页
刘培生%刘亚鸿%杨龙龙%卢颖%王浩
劉培生%劉亞鴻%楊龍龍%盧穎%王浩
류배생%류아홍%양룡룡%로영%왕호
焊点%随机振动%综述%有限元分析%失效%可靠性%板级组件
銲點%隨機振動%綜述%有限元分析%失效%可靠性%闆級組件
한점%수궤진동%종술%유한원분석%실효%가고성%판급조건
solder joint%random vibration%review%finite element analysis%failure%reliability%board level assembly
针对板级组件焊点在随机振动下的可靠性问题,对与之相关的实验研究成果和仿真结果进行了综述。首先介绍了球栅阵列(BGA)封装芯片焊点失效的位置,BGA焊点的材料以及BGA参数和印制电路板(PCB)参数对焊点可靠性的分析,并介绍了疲劳寿命预测方法和子模型法、特殊结构的随机振动分析。最后,提出了随机振动情况下的BGA结构的优化方法。
針對闆級組件銲點在隨機振動下的可靠性問題,對與之相關的實驗研究成果和倣真結果進行瞭綜述。首先介紹瞭毬柵陣列(BGA)封裝芯片銲點失效的位置,BGA銲點的材料以及BGA參數和印製電路闆(PCB)參數對銲點可靠性的分析,併介紹瞭疲勞壽命預測方法和子模型法、特殊結構的隨機振動分析。最後,提齣瞭隨機振動情況下的BGA結構的優化方法。
침대판급조건한점재수궤진동하적가고성문제,대여지상관적실험연구성과화방진결과진행료종술。수선개소료구책진렬(BGA)봉장심편한점실효적위치,BGA한점적재료이급BGA삼수화인제전로판(PCB)삼수대한점가고성적분석,병개소료피로수명예측방법화자모형법、특수결구적수궤진동분석。최후,제출료수궤진동정황하적BGA결구적우화방법。
Aimed at the reliability of board-level assembly solder joint under random vibration, the experimental results and simulation results related to the reliability issues are summarized. Firstly, the failure position of the ball grid array (BGA) solder joint, the material of the BGA solder joint and the parameter of BGA and the parameter of printed circuit board (PCB) which influence the reliability of the solder joint are introduced. Then fatigue life prediction method and the Sub-model method, the random vibration analysis of special structure are described. Finally, the optimization method of BGA is proposed.