CAJ | 학술논문

建立了光互连模块有限元分析模型并进行随机振动加载有限元分析，获取了垂直腔面发射激光器（Verti-cal Cavity Surface Emitting Laser，VCSEL）与耦合元件间的对准偏移；采用水平正交表设计了不同焊点结构参数组合并建立有限元模型，获取了对准偏移数据并进行方差分析。结果表明：在随机振动加载后，光互连模块 VCSEL 与耦合元件间会产生水平、垂直、轴向的偏移；陶瓷基板焊点高度、VCSEL 焊点高度对对准偏移具有高度显著性影响；因素显著性排序由大到小依次为：陶瓷基板焊点高度、VCSEL 焊点高度、陶瓷基板焊点体积和 VCSEL 焊点体积；单因子分析表明 VCSEL与耦合元件对准偏移值随陶瓷基板焊点高度增加而增大，随 VCSEL 焊点高度增加而增大。
건립료광호련모괴유한원분석모형병진행수궤진동가재유한원분석，획취료수직강면발사격광기（Verti-cal Cavity Surface Emitting Laser，VCSEL）여우합원건간적대준편이；채용수평정교표설계료불동한점결구삼수조합병건립유한원모형，획취료대준편이수거병진행방차분석。결과표명：재수궤진동가재후，광호련모괴 VCSEL 여우합원건간회산생수평、수직、축향적편이；도자기판한점고도、VCSEL 한점고도대대준편이구유고도현저성영향；인소현저성배서유대도소의차위：도자기판한점고도、VCSEL 한점고도、도자기판한점체적화 VCSEL 한점체적；단인자분석표명 VCSEL여우합원건대준편이치수도자기판한점고도증가이증대，수 VCSEL 한점고도증가이증대。
A finite element model of optical interconnect module was established.The alignment offset between a VCSEL and coupled elements was obtained with the finite element analysis under random vibration loading.Different solder shape parameter combinations were designed with the horizontal orthogonal tables and used to establish a finite element model.The variance analysis was performed based on the alignment offset data of corresponding solder shape parameters.The results showed that random vibration loading causes horizontal,vertical and axial offsets between VCSEL and coupled elements;both the heights of ceramic substrate solder joint and VCSEL solder joint have a significant effect on the alignment offsets;the four factors are sorted in significance order descending form as follows:the height of ceramic substrate solder joint,the height of VCSEL solder joint,the volume of ceramic substrate solder joint and the volume of VCSEL solder joint;single factor analysis reveals the alignment offset increases with increase in the ceramic substrate solder joint height or the VCSEL solder joint height.